High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
FKN Systek K6000 - Fully automated singulation of up to 10 panels. Singulate Panels with up to 10 Scorelines. Process PCBs with Components up to 2.5" High. Integrated Input and Output Conveyors. Output Conveyor with Loaded Board Detector. Quic
Electronics Forum | Fri Dec 30 05:53:32 EST 2005 | JOE
magazine unloader, flat belt conveyor, or a box with some foam inside of it.
Electronics Forum | Tue Apr 25 13:05:08 EDT 2006 | Hoss
TMC, Are you interested in this approach because you only have a flat belt conveyor and want to keep the components from being moved by the belt on the second pass? If so, you might try adding some stiffeners to the board edges to stand the board o
Used SMT Equipment | AOI / Automated Optical Inspection
Saki BF-Frontier AOI System Model BF-Frontier Vintage: 12/2006 Board Thickness: 0.6 - 2.5mm, 24 - 100mils Board Warp: +/-2mm, 79mils PCB Clearance; Top: 40mm, 1.57in Bottom: 40mm, 1.57in Inspection Categories: Presence/Absence, Misalignment, Tomb sto
Used SMT Equipment | AOI / Automated Optical Inspection
Saki BF-Frontier AOI System Model BF-Frontier Vintage: 12/2006 Board Thickness: 0.6 - 2.5mm, 24 - 100mils Board Warp: +/-2mm, 79mils PCB Clearance; Top: 40mm, 1.57in Bottom: 40mm, 1.57in Inspection Categories: Presence/Absence, Misalignment, Tomb sto
Industry News | 2003-03-25 09:15:19.0
The Dragon was demonstrated at the CPCA show in Shanghai last week
Industry News | 2020-04-14 22:07:07.0
ITW EAE is announcing new features for the MPM® Edison™ Printer. Board staging, designed to meet the demands from Automotive manufacturers for reduced cycle time, will now be a feature on the Edison. And the new EdgeLoc™ II is a robust addition to the side-clamming capability on the Edison.
Parts & Supplies | Assembly Accessories
YAMAHA KKE-M4570-010 IO HEAD BOARD ASSY. YS24 More Yamaha parts in stock YAMAHA FEEDER PARTS CL84/82 K87-M111H-20X BACK STOPPER K87-M111B-00X BACK STOPPER AXIS KW1-M111A-00X SPRING K87-M111G-10X PUSH PIN K87-M111C-00X PLANE WASHER K87-M111P-
Parts & Supplies | Assembly Accessories
YAMAHA KHY-M4570-20 I/O HEAD BOARD ASSY YS12 More Yamaha parts in stock YAMAHA FEEDER PARTS CL84/82 K87-M111H-20X BACK STOPPER K87-M111B-00X BACK STOPPER AXIS KW1-M111A-00X SPRING K87-M111G-10X PUSH PIN K87-M111C-00X PLANE WASHER K87-M111P-0
Technical Library | 2021-06-21 19:34:02.0
In this era of electronics miniaturization, high yield and low-cost integrated circuit (IC) substrates play a crucial role by providing a reliable method of high density interconnection of chip to board. In order to maximize substrate real-estate, the distance between Cu traces also known as line and space (L/S) should be minimized. Typical PCB technology consists of L/S larger than 40 µ whereas more advanced wafer level technology currently sits at or around 2 µm L/S. In the past decade, the chip size has decreased significantly along with the L/S on the substrate. The decreasing chip scales and smaller L/S distances has created unique challenges for both printed circuit board (PCB) industry and the semiconductor industry. Fan-out panel-level packaging (FOPLP) is a new manufacturing technology that seeks to bring the PCB world and IC/semiconductor world even closer. While FOPLP is still an emerging technology, the amount of high-volume production in this market space provide a financial incentive to develop innovative solutions in order to enable its ramp up. The most important performance aspect of the fine line plating in this market space is plating uniformity or planarity. Plating uniformity, trace/via top planarity, which measures how flat the top of the traces and vias are a few major features. This is especially important in multilayer processing, as nonuniformity on a lower layer can be transferred to successive layers, disrupting the device design with catastrophic consequences such as short circuits. Additionally, a non-planar surface could also result in signal transmission loss by distortion of the connecting points, like vias and traces. Therefore, plating solutions that provide a uniform, planar profile without any special post treatment are quite desirable.
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
1.5M LED board conveyor|PCB linking conveyor|PCB inspection station for SMT assemblyhttps://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/177.html ASCEN major for the PCB conveyor and the PCB magazine loader &unloader,PCB depaneling mac
Career Center | Bangalore-560026, Karnataka India | Engineering,Maintenance,Technical Support
New Product Introduction & Product dovelopment
Career Center | Theni, Tamilnadu India | Engineering
NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu
Heller Industries Inc. | https://hellerindustries.com/parts/800523/
800523 - Mesh Belt 20" Wide MWB Balanced Flat (Foot) Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
ASCEN Technology | https://www.ascen.ltd/Blog/machines/226.html
0.5M PCB transfer conveyor PCB board transporter for visual inspection after PCB soldering-PCB magazine loader,PCB turn conveyor,pcb conformal coating machine,PCB router,PCB depaneling machine,pcb