Industry News: flat pac (4)

SMTA Announces Pan Pacific Symposium Call for Participation

Industry News | 2003-05-27 08:13:23.0

The Ninth Annual Pan Pacific Microelectronics Symposium

Surface Mount Technology Association (SMTA)

PDR to Exhibit with PAC Global at the SMTA Dallas & Houston Expos

Industry News | 2020-03-12 06:06:13.0

PDR will exhibit with its representative PAC Global at the SMTA Dallas and Houston Expo & Tech Forums. The Dallas Expo is scheduled to take place Tuesday, March 24, 2020 at the Plano Event Center in Plano, TX, and the Houston Expo will be held Thursday, March 26, 2020 at The Stafford Centre in Stafford, TX. The company will discuss the award-winning IR-E3G Gold Rework System and GenX-90P X-ray System.

PDR-America

Parts & Supplies: flat pac (11)

Samsung FEEDER PARTS J1301164 BEARING

Samsung FEEDER PARTS J1301164 BEARING

Parts & Supplies | Pick and Place/Feeders

R) Rail-sensor J7153115A J7153115A SAMSUNG CP45F (BOARD Flow: R ---> L) Rail-sensor J7153116A J7153116A SAMSUNG CP45F SM320 CP55 VME AKSO (4) BOARD ASSY J9060162A-SAMSUNG CP45F SM320 CP55 limo sensor EE-SX674 J3212022A-SAMSUNG CP45F SM320 faldebl

Jinchen Electric Technology Co,.Ltd

Samsung FEEDER PARTS J7155197A Mirror

Samsung FEEDER PARTS J7155197A Mirror

Parts & Supplies | Pick and Place/Feeders

R) Rail-sensor J7153115A J7153115A SAMSUNG CP45F (BOARD Flow: R ---> L) Rail-sensor J7153116A J7153116A SAMSUNG CP45F SM320 CP55 VME AKSO (4) BOARD ASSY J9060162A-SAMSUNG CP45F SM320 CP55 limo sensor EE-SX674 J3212022A-SAMSUNG CP45F SM320 faldebl

Jinchen Electric Technology Co,.Ltd

Videos: flat pac (1)

Automation Technician's Dream Bundle (Trade School - Technical College)

Automation Technician's Dream Bundle (Trade School - Technical College)

Videos

A jaw-dropping offer for ‘Tech College Instructors', and 'Company Training and Development Managers.' Purchase 'The Maintenance Technician Training Software Bundle' today to avail of the discount. No hidden terms and conditions or extra charges. Bin

Business Industrial Network

Express Newsletter: flat pac (52)

SMTnet Express - January 18, 2018

SMTnet Express, January 18, 2018, Subscribers: 31,180, Companies: 10,857, Users: 24,296 Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for High Performance Flip Chip Package Nokibul Islam, Vinayak Pandey, KyungOe Kim; STATS ChipPAC

Partner Websites: flat pac (8)

Publications

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/publications

Materials - Composite Materials - Counterfeit Detection   Microelectronics - Bonded Wafer FLAT WAFERS AND WARPED WAFERS IMAGED ACOUSTICALLY As published in Silicon Semiconductor, July 2018 IMAGING AND ANALYSIS USING MATCHED ACOUSTIC TOOLS

ASYMTEK Products | Nordson Electronics Solutions

Kapton Polymide Film

ORION Industries | http://orionindustries.com/pdfs/kapton.pdf

. (Average of AC V/mil (kV/mm), (118) (118) (236) (197) (177) (118) ten specimens.) Flat sheets in min. air placed between 1⁄4″ (6 mm) diameter brass electrodes with 1⁄32″ (0.8 mm

ORION Industries


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