Industry Directory | Manufacturer / Other
Established 1991 PITPL undertakes turnkey manufacture of PCB assemblies ,box builds,LED lamps for both prototype/ mass production.Capabilities include assembling 0201,microBGA,UCSP,flex pcbs.we are ISO9001/TS16949 qualified.
Industry Directory | Manufacturer
We are electronic manufacturing company that specializes in 24-48hr. Turn around as well as critical or complex rework.
BGA, flex-BGA, uBGA, CBGA and CSP Dummy Components with daisy chain for solder practice and temperature profiling.
1109 20GHz TDR Tester Product Classification: TDR Method Impedance Tester for High Speed, High Frequency Boards Product Description: The 1109 20GHz TDR Tester provides a test head equipped with dedicated high-frequency probes for TDR measurement w
Electronics Forum | Tue Jan 12 15:04:40 EST 1999 | Earl Moon
| I have used conductive adhesives for some time now on thickfilm. Does anyone know of a really good conductive adhesive to attach flip chips to flex circuits? I would like to stencil print the adhesive to the substrate and then place the flips chi
Electronics Forum | Bob |
Wed Apr 07 19:40:07 EDT 1999
Used SMT Equipment | X-Ray Inspection
This Phoenix X-Ray system will be available in the M-Flex Online Auction being held on Dec. 14-15. These assets are located in Anaheim, California and will be sold to the highest bidder. Phoenix Nanome/x 180 X-Ray System; Model: Nanome/x 180; SN: A
Used SMT Equipment | Coating and Encapsulation
Make: PVA Model: Delta 6 Vintage: 2014 Power: 240v, 25A, 60hz PSI: 80-100 3 Axis Fiducial Camera Belt Conveyor PCB Heat JDX + PVA Jet Controls (IO Card) Vacuum Purge Weigh Scale Machine was configured for Underfill, Flip Chip, BGA, Flex a
Industry News | 2003-05-21 08:13:48.0
Two half-day workshops on Thursday during SMTA
Industry News | 2001-02-27 22:31:53.0
IPC has announced a call for papers for the IPC Annual Meeting, which takes place October 8-13, 2001, at the Rosen Centre Hotel in Orlando, FL.
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Parts & Supplies | Pick and Place/Feeders
> www.greensmt.com JUKI E9572729CA0 LA (L) CABLE ASM. SHENZHEN GREEN TECHNOLOGY CO.,LTD JUKI E95737290A0 MTC I/F(L) CABLE ASM. www.greensmt.com JUKI E95738550A0 DISPESE SV ASM SHENZHEN GREEN TECHNOLOGY CO.,LTD JUKI E95747210A0 BAD MARK SENSOR CAB
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Parts & Supplies | Pick and Place/Feeders
> www.greensmt.com JUKI E9572729CA0 LA (L) CABLE ASM. SHENZHEN GREEN TECHNOLOGY CO.,LTD JUKI E95737290A0 MTC I/F(L) CABLE ASM. www.greensmt.com JUKI E95738550A0 DISPESE SV ASM SHENZHEN GREEN TECHNOLOGY CO.,LTD JUKI E95747210A0 BAD MARK SENSOR
Technical Library | 2024-08-20 00:40:08.0
In electronics manufacturing, 'Underfill' refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit.
Technical Library | 2025-08-29 13:53:05.0
In electronics manufacturing, "underfill" refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit. It is also important in 3D ICs and advanced packaging technologies that involve stacking multiple chips or integrating multiple functions into a single package.
SMTA International Electronics Exhibition Tuesday, September 29: 9am-5pm Wednesday, September 30: 9am-4pm Donald Stephens Convention Center Rosemont, IL See More Equipment & Technology Than Ever Before! Many of the 160 exhibiting companies will bri
https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/100.html PCB linking conveyor and PCB belt conveyor mainly used to connect different type PCB board handing equipment effectively for the SMT production line. ASCEN technology is ava
Training Courses | ON DEMAND | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Sun Sep 27 00:00:00 EDT 2020 - Thu Oct 01 00:00:00 EDT 2020 | Rosemont, Illinois USA
SMTA International 2020 Conference & Exhibition
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | , California | Quality Control
Tammy T Vo P.O. Box 2213 (714) 254-5073 E-mail: nhutamvo@yahoo.com Position of Interest Senior Quality Inspector Aerospace Manufacturing. / Electronic PCBA/Advanced coating technologies Profile of Qualifications 12 years of experience wo
SMTnet Express, October 6, 2016, Subscribers: 26,499, Companies: 14,980, Users: 41,213 Figure 1-An IoT PCB Using Rigid-Flex Construction PCB Laser Depanelizing Using a UV Laser Bob Wettermann; BEST Inc. One of the methods gaining in popularity
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
begin your search Close Search • Technology Roadmap 2017 2018 2019 2020 Material • Taconic • MAGTRON • FR 4 • ISOLA • Polymide-Flex • Metal Core Min. Dieletric Thickness 2 mil Max
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=ALTERA&PN=EPF6016AFC100-1
: IC, FLEX 6000 Programmable Logic Device Physical Description: Ball Grid Array (BGA), 1.00 mm pitch, square; 100 pin, 11.00 mm L X 11.00 mm W X 1.70 mm H body Commonly Visited: Discussion Forum Software User Guide Free Downloads Contact us Websites Contact Sales, Training, Support
