UV PCB Laser Cutting Machine Application FPC and some relative materials; FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting; UV PCB Laser Cutting Machine Parameter Parameter
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Electronics Forum | Thu Aug 09 16:24:27 EDT 2018 | ks0707
Hi Thomas, Thank you for your posting and I agree with you that Printing is the most difficult one. BTW, after you ran the one side (let's say Bottom side), my engineer worries about the distortion of flex board because of the thickness. In that ca
Electronics Forum | Wed May 16 15:40:56 EDT 2012 | davef
Here's some notes from a Bob Willis presentation Assembly of Flexible Circuits with Lead-Free Solder Alloy [Bob Willis leadfreesoldering.com] * Flexible Circuit Construction ** Base Material - 0.05mm Copper 18/18 um ESPANEX from Holders Technologies
Industry News | 2009-07-17 19:02:35.0
The FLX2011-MK, Essemtec’s production center for flexible circuits and membrane keyboards, is now equipped with a jet valve dispensing system, allowing it to place smaller SMD components and LEDs on flexible circuits. The jet valve dispenses small glue dots more accurately and faster than others, and is contactless.
Industry News | 2011-06-16 14:42:47.0
Cognex has released a new version of In-Sight® Explorer 4.5, expanding the capabilities of In-Sight vision systems and giving In-Sight the most advanced inspection tools available today. In-Sight Explorer 4.5 inspection tools now include an all-in-one edge and surface inspection tool, an all-in-one bead width and position tool, and a robust ID tool that reads multiple codes at one time, allowing In-Sight cameras to read barcodes and provide inspections simultaneously.
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PicoScope 6000E Series oscilloscopes address complex waveform analysis challenges with up to 500 MHz bandwidth, 8 to 12 bits of vertical resolution and up to 4 gigasamples of deep capture memory. 21 serial protocol decoder / analyzers included as sta
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. Maintain tight side, leading and trailing edge control and superior cutoff. Reduce heat distortion or strike-through on extremely thin or heat-sensitive substrates
