New SMT Equipment: flow solder pre-heat temperature (73)

High Precision Dispenser - MAX II (Heated Dispenser)

High Precision Dispenser - MAX II (Heated Dispenser)

New Equipment | Dispensing

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Large / Versatile Board Processing - DS Series Dispenser

Large / Versatile Board Processing - DS Series Dispenser

New Equipment | Dispensing

When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste

GPD Global

Electronics Forum: flow solder pre-heat temperature (218)

Wave soldering preheat temperature

Electronics Forum | Sat Apr 14 00:04:21 EDT 2001 | zam_bri

I'm not a Wave soldering guy and my friend have asked me a question on what is the best preheat time and temperature for Wave soldering.They experiences only 10% flow up thru the PTH barrel. I've asked them to increase the temperatue to 120 Deg C. Cu

Re: flow thru

Electronics Forum | Sun Oct 31 08:27:09 EST 1999 | Dave F

David: I think it's great that you are getting that much barrel fill with STEEL leaded components!!! So, what kind of steel are the leads are made from? How much corrosion is on the leads? Frankly, I don't believe that the leads are made of steel

Used SMT Equipment: flow solder pre-heat temperature (41)

SEHO StartSelective

SEHO StartSelective

Used SMT Equipment | Soldering - Selective

Vintage 2019 The perfect plug-and-produce selective soldering system for entry-level automated soldering. holding device for workpiece carrier / workplace of 508 x 508 mm [20" x 20"], without downholders 3-axes system with spindle axes and AC servomo

Petlock Incorporated

Nordson Select Novo 102

Nordson Select Novo 102

Used SMT Equipment | Soldering - Selective

Make:  Nordson Model:  Select Novo 102 Vintage:  2020 Description:  Selective Solder Details: Lead-Free Titanium Solder Pot & Pump Assembly Solder Pot Capacity: 30 lbs Software: SWAK-OS 4.0 (Includes Automated Fiducial Alignment, Board Warp Compensa

Lewis & Clark

Industry News: flow solder pre-heat temperature (110)

No Solder Required for Press-fit D-subs

Industry News | 2003-04-08 10:28:06.0

A new range of high-performance press-fit D-subminiature terminations from GTK can be fitted easily to PCBs without the need for solder.

SMTnet

How the modern solder reflow oven works?

Industry News | 2018-10-18 08:36:26.0

How the modern solder reflow oven works?

Flason Electronic Co.,limited

Parts & Supplies: flow solder pre-heat temperature (7)

Global Active Wave Soldering Machine GS350P

Global Active Wave Soldering Machine GS350P

Parts & Supplies | Soldering - Wave

Overseas Agent and Distributor Wanted ! Features : Spray Fiuxer: 1) Oriental motor drives the flux spraying system. Spraying speed is adjusted according to PCB board width and moving speed to ensure even spraying all time. 2) Durable “Meiji

Xtreme Marketing LLP

JOT Optical BGA Rework Station

JOT Optical BGA Rework Station

Parts & Supplies | Repair/Rework

PG-P6800 Main Features: 1、There are 3 independent heaters. The 1st and 2nd hot-air heaters can control multiple groups and segments temperature parameters. The 2nd heater can move up and down. The 3rd large area IR heater can preheat the PCB boar

Goodluck Electronic Equipment Co.,Ltd

Technical Library: flow solder pre-heat temperature (5)

Precision Control in Electronic Assembly: Selective Wave Soldering Machine

Technical Library | 2024-02-26 09:08:23.0

Precision Control in Electronic Assembly: Selective Wave Soldering Machine Discover the technical features of I.C.T's Selective Wave Soldering Machines, including precision flux application and innovative preheating systems. Learn how these machines redefine efficiency and reliability in electronic assembly. Introduction: Enhancing Precision Soldering: Technical Features of Selective Wave Soldering Machines by I.C.T Explore the innovative design and operation of I.C.T's Selective Wave Soldering Machines, featuring a seamless PCB handling system and modular design for enhanced assembly line flexibility. Experience precision control and efficiency with comprehensive PC controls, allowing easy adjustment of solder parameters like temperature and flux type. Automatic calibration and CCD mark positioning ensure consistent soldering quality. Detail Excellence: Enhancing Selective Wave Soldering Technology Flux System Mastery German high-frequency pulse injection valve ensures precise flux application. Optional flux nozzle jam detection simplifies maintenance. Pressure tank and precision pressure flow meter ensure consistent flux control. Preheat System Excellence Bottom IR preheating system ensures stability and efficiency. Maintenance is simplified with a tool-free mode and plug-in design. Soldering System Innovation Swedish "PRECIMETER" electromagnetic pump coil ensures stability. Stainless steel soldering pot prevents tin liquid leakage. N2 online heating system reduces solder dross. Transmission System Mastery Specially designed material profiles ensure operational stability. Thickened customized rails guarantee flawless operation. Control and Intelligence Keyence PLC+module high-end bus control system ensures stability. Industry 4.0 compliance allows guided programming and real-time data visualization. Market Promotion and Success Stories: Elevating Selective Wave Soldering Machine I.C.T's strategic market positioning has led to global success across diverse industries. Success stories from European clients highlight reliability and trust in the machine. Over 70 units sold across 20+ countries since 2022, establishing its industry-leading position. Conclusion Conclusion: I.C.T's Selective Wave Soldering Machine combines technical excellence with global market success, solidifying its leadership in precision soldering technology.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Solder Joint Encapsulant Adhesive - LGA High Reliability And Low Cost Assembly Solution

Technical Library | 2016-01-12 11:01:25.0

More and more Land Grid Array (LGA) components are being used in electronic devices such as smartphones, tablets and computers. In order to enhance LGA mechanical strength and reliability, capillary flow underfill is used to improve reliability. However, due to the small gap, it is difficult for capillary underfill to flow into the LGA at SMT level. Due to cost considerations, there are usually no pre-heating underfill or cleaning flux residue processes at the SMT assembly line. YINCAE solder joint encapsulant SMT256 has been successfully used with solder paste for LGA assembly. Solder joint encapsulant is used in in-line LGA soldering process with enhanced reliability. It eliminates the underfilling process and provides excellent reworkability. The shear st rength of solder joint is stronger than that of underfilled components. The thermal cycling performance using solder joint encapsulant is much better than that using underfill. Bottom IC of POP has been studied for further understanding of LGA assembly process parameters. All details such as assembly process, drop test and thermal cycling test will be discussed in this paper.

YINCAE Advanced Materials, LLC.

Videos: flow solder pre-heat temperature (43)

HELLER INDUSTRIES Presents: 1936 MKV Vacuum Reflow Oven

HELLER INDUSTRIES Presents: 1936 MKV Vacuum Reflow Oven

Videos

1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C

Heller Industries Inc.

MAX II - Heated.  Underfill with Jetting Pump NCM5000

MAX II - Heated. Underfill with Jetting Pump NCM5000

Videos

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Events Calendar: flow solder pre-heat temperature (2)

SMTA Mexico Expo 2019

Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico

SMTA Mexico Expo 2019

YINCAE Advanced Materials, LLC.

SMTA Mexico Expo 2019

Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico

SMTA Mexico Expo 2019

YINCAE Advanced Materials, LLC.

Career Center - Resumes: flow solder pre-heat temperature (5)

Electronics Manufacturing

Career Center | Brookfield, ALL USA | Management,Production

Training and Qualifications Mil standards 464 Mil Standards 2000 ESD Training Cellular Manufacturing TQM Totally Quality Manufacturing ISO 9000 and 9001 IPC Standards, IPCA-610 IPC-J-STD-001E OSHA training LEAN Manufacturing, JIT (Just In T

Boise Resume

Career Center | , | 2011-11-16 09:17:11.0

Mil standards 464, Mil Standards 2000, ESD Training, Cellular Manufacturing, TQM Totally Quality Manufacturing, ISO 9000 and 9001 IPC Standards, IPCA-610, IPC-J-STD-001E, OSHA training, LEAN Manufacturing, JIT (Just In Time) Six Sigma, AS400 Systems

Express Newsletter: flow solder pre-heat temperature (1009)

Partner Websites: flow solder pre-heat temperature (389)

Heat Seal Bonding Systems

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/processes/heat-seal-bonding-systems

.   C-Drive Head The C-Drive Bond Head is designed to deliver quality solder joints and Heat Seal bonds consistently. When coupled with a C-Flow Controller, Temperature, Force, and Displacement Monitoring give

ASYMTEK Products | Nordson Electronics Solutions

slag solder separator SMT solder dross recovery system -PCB magazine loader,PCB turn conveyor,pcb co

ASCEN Technology | https://www.ascen.ltd/Video_Channel/Non-standard_equipment/510.html

:   Low temperature separation: the machine only need to heat up to 280 degrees can be separated;   Pure physical way: do not need to add any chemical non-chemical substances

ASCEN Technology


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Component Placement 101 Training Course
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Training online, at your facility, or at one of our worldwide training centers"