Industry Directory | Manufacturer
Suppliers of solder pastes, wave soldering liquid fluxes and SMT adhesives and cored solder wires for all soldering requirements.
Industry Directory | Manufacturer
UK manufacturer for solder pastes, bar solder, cored solder wires, fluxes and cleaning products
New Equipment | Wave Soldering
The Ideal Wave Soldering System for Low-to-Medium Volume Lead-free Pproduction. The award-winning ELECTROVERT VectraES wave soldering system features exceptional system-wide accessibility, an advanced control system and innovative sub-system technol
New Equipment | Wave Soldering
The most advanced high-performance wave soldering system designed for high-volume manufacturing. Electra's proven performance has provided the electronics assembly industry with world-class soldering results. The Electra system is designed with
Electronics Forum | Wed Oct 23 08:40:20 EDT 2002 | davef
Yer not making this easy. What kind of flux? If no-clean flux, what controls are you using to assure you are: * Applying the correct amount of flux? * Properly activating the flux? If water washable flux, talk to us about your cleaning methods and
Electronics Forum | Tue Jan 08 17:29:20 EST 2002 | davef
Your research is on track. NC flux needs to reach activation temperature. Also, do not depend on the corrosion characteristics associated with the flux classification (ie, L1, L0, M1, M0, etc.), until the flux is activated by exposure to soldering
Used SMT Equipment | Soldering Equipment/Fluxes
Air-Vac Solder Reflow System, Model: PCBRM System 5.2, Includes footswitch Complete Capability for Low Volume Automated Selective Soldering of Through Hole Components Fume Extraction Manifold Option The PCBRM System 5.2 has all of the feature
Used SMT Equipment | Soldering Equipment/Fluxes
Air-Vac Solder Reflow System, Model: PCBRM System 5.2, Includes footswitch Complete Capability for Low Volume Automated Selective Soldering of Through Hole Components Fume Extraction Manifold Option The PCBRM System 5.2 has all of the feature
Industry News | 2023-06-12 21:14:11.0
The 2023 Beijing Intelligent Manufacturing and SMT Technology Exchange Conference, hosted by the Intelligent Manufacturing Committee of the Beijing Electronics Society, was successfully held in Beijing on May 25th. HELLER was honored to be invited and actively participated by sharing their cutting-edge technology and expertise.
Industry News | 2008-10-26 00:28:46.0
ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Dave Adams (Session Chair) of Rockwell Collins, Lee Flasche of Delphi Electronics Group, Dr. Ning-Chen Lee of Indium Corporation, Steve Hugh of Philips Medical, and Dr. Ken Dishart formerly of DuPont will present in Session 4 on Lead-Free Cleaning. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008
Parts & Supplies | SMT Equipment
03059051-01 Lifting Table Dual Conveyor X4i 03059195-01 Retrofit kit pneumatic unit D1 03059196-01 Gas Spring 400N ( for D1/D2 Left Hood) 03059238S01 Linear Dipping Unit (LDU) Basis 03059375-01 Starter kit filter disc 2-parts / C+
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Parts & Supplies | SMT Equipment
03059486S01 COUPLER 03059594-01 Keyboard AK-4400-GU-W/GE 03059595-02 PS2-Tastatur Active Key mit Touch-Pad 03059733-01 Main switch 3LD2 with shaft length 59mm 03060396S01 station computer-HS50/60 (ESPRIMO P5915) 03060695S03 Splice Sensor B3+ / X
Technical Library | 2020-11-24 23:01:04.0
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. The paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosivity with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.
Technical Library | 2016-12-29 15:37:51.0
The reliabilities of the flux residue of electronic assemblies and semiconductor packages are attracting more and more attention with the adoption of no-clean fluxes by majority of the industry. In recent years, the concern of "partially activated" flux residue and their influence on reliability have been significantly raised due to the miniaturization along with high density design trend, selective soldering process adoption, and the expanded use of pallets in wave soldering process. When flux residue becomes trapped under low stand-off devices, pallets or unsoldered areas (e.g. selective process), it may contain unevaporated solvent, "live" activators and metal complex intermediates with different chemical composition and concentration levels depending on the thermal profiles. These partially-activated residues can directly impact the corrosion, surface insulation and electrochemical migration of the final assembly. In this study, a few application tests were developed internally to understand this issue. Two traditional liquid flux and two newly developed fluxes were selected to build up the basic models. The preliminary results also provide a scientific approach to design highly reliable products with the goal to minimize the reliability risk for the complex PCB designs and assembly processes. This paper was originally published by SMTA in the Proceedings of SMTA International
DescriptionThe Electrovert® Electra™ is an advanced, meticulously engineered wave soldering system designed for high-mass and high-volume manufacturers. Although intended for maximum throughput requirements, the Electra also offers maximum process fl
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Career Center | South Plainfield, New Jersey USA | Engineering
Alpha, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED ligh
Career Center | New Castle, Pennsylvania USA | Production
Surface Mount Tech - Printed Circuit Board (PCB) Summary: **All applicants must be familiar with: Quad 4C equipment*** Will be responsible for Surface Mount Parts and Screen Printing Other responsibilities may include: Moves controls to activate
Career Center | Chennai, India | 2017-03-01 02:21:39.0
Maintenance,Technical Support
Career Center | Riyadh 11623, Philippines | Engineering,Maintenance,Production
PROFESSIONAL EXPERIENCE: Connected in the field of manufacturing/electronics industry experienced in the line, Through Hole and Surface Mount Technology, worked on various Fuji Machines Universal model, such as: CP 643E chip shooter QP 242E chip mou
SMTnet Express, December 29, 2016, Subscribers: 30,326, Companies: 15,062, Users: 41,660 Partially-Activated Flux Residue Impacts on Electronic Assembly Reliabilities Yanrong Shi, Ph.D., Kyle Loomis, Jennifer Allen, Bruno Tolla, Ph.D.; Kester
Heller 公司 | http://hellerindustries.com.cn/00600-248.pdf
. Applications for which the (a) profile are appropriate include pastes that require a dwell time at 150° to 160°C to allow for flux activation, and for IR-based ovens that create large temperature differentials (∆T
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/00600-248.pdf
. Applications for which the (a) profile are appropriate include pastes that require a dwell time at 150° to 160°C to allow for flux activation, and for IR-based ovens that create large temperature differentials (∆T
