Industry Directory | Manufacturer
Manufacturer of materials for the electronics assembly marketplace. Our RoHS-compliant products include solder pastes, fluxes, solder powder, core wire and bar solder and process support products.
New Equipment | Cleaning Agents
KYZEN® Defoamer is an effective de-foaming agent to eliminate foam build-up in aqueous in-line cleaners. KYZEN Defoamer has been found to be especially effective for use in captured wash tanks where water soluble flux residues cause excessive foaming
New Equipment | Rework & Repair Equipment
Production BGA Installation & Rework WITHOUT the Expensive Nozzles! The IR 3000 is the most advanced BGA rework system available on the market today. It can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's. Featuring a 500W in
Electronics Forum | Thu Jan 18 12:30:19 EST 2007 | slthomas
Change pastes, although insufficient heating may leave excessive residues. Is this on one board or all products? No Clean or water soluble? Do you profile accurately or "guesstimate" your settings?
Electronics Forum | Wed Apr 28 14:52:03 EDT 2010 | davef
When we hear the words 'flexible circuit' and 'delamination' in the same sentence, we think: * Excessive reflow temperature. * Entrapped moisture. Boardhouse: I hope this is a step towards redemption.
Used SMT Equipment | Soldering Equipment/Fluxes
Versaflow Selective soldering Selective Soldering Process Advantages: Better, Faster, Cleaner & Cheaper! . consistent LF solder joint quality & significant reduction of DPM . No re-melting of top side SMD components, as with wave soldering . PCB
Industry News | 2018-10-18 08:27:03.0
An Analysis of SMT Solder Paste Printing Defects
Industry News | 2001-10-16 14:59:48.0
IPC honored 16 members at the IPC Annual Meeting in Orlando, FL, for their contributions to IPC and the electronics industry.
Parts & Supplies | Soldering Equipment/Fluxes
3D Solder Paste Inspection Machine Features : Easy to use by fully motorize X-Y scan mechanism. Easy to program by Gerber image navigator Easy to repeat the same job by loading the saved program User-friendly color image live view operation Ea
Technical Library | 2022-03-16 19:48:18.0
Dendrites, Electrochemical Migration (ECM) and parasitic leakage, are usually caused by process related contamination. For example, excess flux, poor handling, extraneous solder, fibers, to name a few. One does not normally relate these fails with environmental causes. However, creep corrosion is a mechanism by which electronic products fail in application, primarily related to sulfur pollution present in the air.1 The sulfur reacts with exposed silver, and to a lesser extent, exposed copper. This paper will explore various aspects of the creep corrosion chemical reaction
Technical Library | 2007-08-09 12:23:10.0
Recent developments in No Flow-Fluxing Underfill (NFFUF) products have demonstrated their utility to enhance the reliability of flip chip assemblies with reduced processing steps over conventional capillary flow methods. This basic work considered processing conditions such as dispensed volume and placement force, speed and dwell time. Further evaluations of these new products on a variety of flip chip assembly configurations manufactured by various processes have been undertaken to provide further evidence of their suitability and potential in high volume electronic manufacturing. This paper summarizes the recent evaluations and discusses new studies of additional assembly configurations, which include higher input/output (l/O) counts up to full arrays in excess of 1200 l/Os.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
"The IR 3000 offers advanced surface mount rework capability in an integrated, cost-effective, bench-top work station." This video covers the basic processes of the IR 3000, focusing primarily on: Installations, Removals, Component Alignment and Ins
SMT Express, Volume 2, Issue No. 6 - from SMTnet.com Volume 2, Issue No. 6 Wednesday, June 14, 2000 Featured Article Return to Front Page Process Control for Solder Flux Stacy KaliszMark OwenMVTechnology Ltd. ABSTRACT Flux used in ball grid
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-faqs
Solder Paste and Flux Frequently Asked Questions | Nordson EFD Search Arrow Black Arrow Right Arrow Youtube Twitter Facebook Paper Plane LinkedIn Zoom In Grid Envelope Earth Download File - Document 9 Boxes Browser Calendar Chart Click Icon Close
Imagineering, Inc. | https://www.pcbnet.com/blog/identifying-and-correcting-solder-bridge-defects/
. Finally, ensure that you are not mixing old and new flux, and that the flux you are using has not expired. Stencil – When a stencil is not properly cleaned, residue can accumulate and result in solder bridging defects in subsequent printings
