LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &
Electronics Forum | Tue Jun 02 07:31:55 EDT 2009 | scottp
Early on when we started looking at BGAs we tried dipping. We've done it in production for a couple decades with flipchips. Dip fluxing BGAs worked fine in the lab but we ended up starting production with screen printed flux for cycle time reasons.
Electronics Forum | Fri May 08 16:30:59 EDT 1998 | Chrys
| I am running boards with gold fingers on a pallet for | masking purposes. The pallets worked fine for a while | but know the gold fingers are getting solder on them. We | have tried everythin: new pallets, cleaning the pallet | and board to be s
Used SMT Equipment | Soldering - Reflow
BTU Pyramax 125N Parameters Pyramax Specifications Model Pyramax 125N Atmosphere Air or Nitrogen Conveyor Speed 10-60 in/min 25-152 cm/min Conveyor Width 2-18 in 51-457 mm Heated Length 125 in 3175 mm Heated Zones&
Industry News | 2010-09-20 19:36:19.0
Industry-leading associations IPC and SMTA jointly announce the agenda for Session 1 of the High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, Illinois.
Industry News | 2010-10-01 01:24:05.0
Industry-leading associations IPC and SMTA jointly announce the chairs of Workshop 1 of the High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, Illinois.
Technical Library | 2014-05-12 09:24:11.0
With the advancement of the electronic industry, Package on package (POP) has become increasingly popular IC package for electronic devices, particularly in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far, no customer has reported using these methods or materials in their mass production. In order to address these issues for POP assembly, YINCAE has successfully developed a first individual solder joint encapsulant adhesive.
Technical Library | 2014-06-02 11:03:45.0
With the advancement of the electronic industry, package on package (POP) has become increasingly popular IC package for electronic devices, particularly POP TMV (Through Mold Vials) in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far no customer has reported using these methods or materials in their mass production. In order to address these issues for POP TMV assembly, YINCAE has successfully developed and commercialized the first individual solder joint encapsulant adhesive for mass production for years.
SMTA International Electronics Exhibition Tuesday, September 29: 9am-5pm Wednesday, September 30: 9am-4pm Donald Stephens Convention Center Rosemont, IL See More Equipment & Technology Than Ever Before! Many of the 160 exhibiting companies will bri
LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &
Events Calendar | Sun Sep 27 00:00:00 EDT 2020 - Thu Oct 01 00:00:00 EDT 2020 | Rosemont, Illinois USA
SMTA International 2020 Conference & Exhibition
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
boards soldered with no-clean and lead-free flux tec
SMTnet Express, November 7, 2019, Subscribers: 32,325, Companies: 10,919, Users: 25,284 Origin and Quantification of Increased Core Loss in MnZn Ferrite Plates of a Multi-Gap Inductor Credits: Power Electronic Systems Laboratory (PES) Inductors
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/products/valves?con=t&page=32
for precise applications of different materials during manufacturing Products Content Your results for: Fluid Dispensing Valves Jetting Underfill on Flex into a Small Gap 04 x 05 mm Nordson ASYMTEK (AHS-032, May 2008
Blackfox Training Institute, LLC | https://www.blackfox.com/how-to-remove-oxidation-from-soldering-iron-tips/
) Apply flux cored solder on the oxidized tip. Once the flux is activated it starts a chemical reaction that removes the oxidation. Clean the tip with a brass wool or automatic tip cleaners Repeat the steps above until the tip is visibly clean If the tip is still not clean after this process, move on to the next step
