World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati
Electronics Forum | Wed Dec 27 20:33:50 EST 2006 | greg york
water alone especially cold is not good enough, how do you check for hasl fluids when most residues left behind after improper cleaning are non ionic. Use 40C saponifier followed by heated rinse then cold rinse then DI rinse followed by dry.Nylon bru
Electronics Forum | Wed Jan 18 16:30:30 EST 2006 | davef
380SR-flux gel is sold by Cobar. Look here: http://www.lumileds.com/pdfs/AB10.PDF This application note suggests: * �#1;Metals 390DH4 * �#1;Metals LR735 * �#1;Metals NS4029 * ESP 6#1;412 * Cobar 380SR#1;flux gel Comments are: * "�#1;Metals" is "A
Industry News | 2011-01-20 13:45:14.0
IPC will introduce a cyber conference at IPC APEX EXPO in Las Vegas in 2011. The IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of seven of the show's thirty-five technical conference sessions on April 12–14, 2011.
Industry News | 2009-07-17 18:26:03.0
POWAY, CA — July 2009 — EasySpheres LLC highlights RF741 No-Clean Gel Flux designed for electronic component rework and repair applications.
Technical Library | 2017-12-11 22:31:06.0
Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode setup. Localized extraction of residue was carried out using a commercial C3 extraction system. Results clearly show that the amount and distribution of flux residues are a function of the soldering process, and the level can be reduced by an appropriate cleaning. Selective soldering process generates significantly higher levels of residues compared to the wave and reflow process. For conformal coated PCBAs, the contamination levels generated from the tested wave and selective soldering process are found to be enough to generate blisters under exposure to high humidity levels.
"The IR 3000 offers advanced surface mount rework capability in an integrated, cost-effective, bench-top work station." This video covers the basic processes of the IR 3000, focusing primarily on: Installations, Removals, Component Alignment and Ins
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The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
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Europe Chapter Webinar: Manual Cleaning of Printed Board Assemblies – Step by Step Guide
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6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
