Industry Directory | Manufacturer
developing, manufacturing, selling and servicing: soldering flux, solder pastes, solder wires and related products for the electronics assembly industry. solder wire, solder paste, soldering flux, cored wire, fluxes, selective, reflow, wave solder
Manufacturer lead-free ready automated production systems: Wave soldering, spray flux applicaiton, selective soldering, reflow, conduction belts.
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems. Lead Free Certified reflow oven! Maintenance Free! Lowest Nitrogen &
Electronics Forum | Thu May 13 20:38:32 EDT 1999 | lima
Does anyone know of any industry guidelines for the exhausting of volatiles in reflow ovens? I've seen some numbers like 1,000ppm for the oven atmosphere, but is this typical? My concern is the volatiles in my WS629 solder paste may be attacking th
Electronics Forum | Fri May 14 00:16:28 EDT 1999 | Mike D.
| Does anyone know of any industry guidelines for the exhausting of volatiles in reflow ovens? I've seen some numbers like 1,000ppm for the oven atmosphere, but is this typical? | | My concern is the volatiles in my WS629 solder paste may be attack
Used SMT Equipment | Soldering - Reflow
Senju SNR-825 Reflow Oven Serial Nr: 3207043 Manufactured Year: 2009 Board Counter: 85499 Direction: Left to Right Lead Free Heating Zones: 8 Zones, Top and Bottom Cooling Zone: 1 Zone, Water Cool Conveyor Speed: 0.3 – 2.0 m/min
Used SMT Equipment | Soldering - Reflow
• Nitrogen • Edge Belt Conveyor • Mesh Belt Conveyor • Auto Chain Oiler • 350 C Max Temp • Flux Management System • 480, Volt, (3) Phase • (10) Upper and (10) Lower Convection Heating Zones • (2) Cooling Zones • Condition: Complete & Operat
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2013-09-10 17:48:54.0
We are happy to announce that we have opened a new Class 10K cleanroom in the NJ facility.
Parts & Supplies | Soldering Equipment/Fluxes
3D Solder Paste Inspection Machine Features : Easy to use by fully motorize X-Y scan mechanism. Easy to program by Gerber image navigator Easy to repeat the same job by loading the saved program User-friendly color image live view operation Ea
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2020-01-28 00:23:58.0
This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.
Nano-copper sintering in formic acid vapor.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Tue Apr 14 00:00:00 EDT 2020 - Tue Apr 14 00:00:00 EDT 2020 | ,
Why Are We Cleaning No-Clean?
Events Calendar | Mon Feb 11 00:00:00 EST 2019 - Mon Feb 11 00:00:00 EST 2019 | ,
Webinar: Solder Paste Evaluation & Simple Tricks of the Trade
Career Center | , Alabama Saudi Arabia | Engineering,Production,Research and Development
SNR MANUFACTURING ENGINEER WANTED Design Change Management and New product Introduction. Solder paste printing process (knowledge of Fuji screen printer machines. Stencil design/ modification and the use of Gerber data. SMT placement machines (Kno
Career Center | Research Triangle Park, North Carolina USA | Sales/Marketing
Worldwide supplier of solderpaste, flux, adhesives and solder sphere's seeking Independant Manfacturers' Representatives for select protected territories in Illinois, Ohio, Pennsylvania, New York, New Jersey and the Provinces of Canada. Experience in
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
Career Center | Riyadh 11623, Philippines | Engineering,Maintenance,Production
PROFESSIONAL EXPERIENCE: Connected in the field of manufacturing/electronics industry experienced in the line, Through Hole and Surface Mount Technology, worked on various Fuji Machines Universal model, such as: CP 643E chip shooter QP 242E chip mou
SMT Express, Volume 4, Issue No. 5 - from SMTnet.com Volume 4, Issue No. 5 Thursday, May 23, 2002 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: Reflow Soldering
Heller Industries Inc. | https://hellerindustries.com/reflow-oven-flux-removal/
. Doubles PM interval No impact to thermal profile How it Works The reflow oven flux removal system from Heller is a low temperature integrated catalyst installed in the heat modules
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