Industry Directory | Distributor / Manufacturer's Representative
Manufacturer's representative/distributor of equipment and consumables used in the PCB assembly industry. We specialize in soldering and cleaning equipment and also tape splicing products including cover tape extenders and tools.
Industry Directory | Manufacturer
The exclusive supplier of SIPAD Solid Solder Deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world.
New Equipment | Education/Training
In this One-Day class you will learn successful techniques to re-ball BGA Components. Both Lead and Lead Free Solder Balls will be covered. The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
Electronics Forum | Thu Nov 11 13:00:20 EST 2010 | 18424
Thanks Dennis, The fact that someone other than myself has experienced this is good to hear. Solder mask type should be spec'd all the same through out the many board suppliers we use but its worth the check.I have checked with kester but am still aw
Electronics Forum | Thu Nov 04 10:29:10 EDT 2010 | 18424
Hello all, Has anyone used Kester 2331-ZX water soluble flux on selective soldering and expirienced a white film after soldering. I have seen this on and off for a few weeks now and believe it is a chemical reaction with the solder mask or improperly
Used SMT Equipment | Soldering Equipment/Fluxes
In-line Selective Solder S/N : 0611830601 Description: * Two Pots: SAC305 PB-Free * Includes Gas Nitrogen circuit * 3x400 V 33 kVA 50/60Hz * 410mm x 410mm Standard Gripper * Preheater with 12 IR Elements * Gantry robot fluxer (with flux m
Used SMT Equipment | Soldering - Wave
Vintage: 2000 (preferably higher) Solder pot: lead-free (preferably SAC 305 solder) Fingers: heavy duty fingers
Industry News | 2003-05-19 10:06:43.0
The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Parts & Supplies | Chipshooters / Chip Mounters
> JUKI ESL13000000 VACUUM PAD 15 JUKI ESL13000100 PHOTO MICRO SENSOR A JUKI ESL13001000 TUBE union (KL700) JUKI ESL130011A0 CONVEYOR MOTOR (KZ500) JUKI ESL13002000 CLAMP LEVER JUKI ESL13003000 T TYPE NUT JUKI ESL130031A0 OPERATION PANEL (KL700) JUKI
Parts & Supplies | Pick and Place/Feeders
> FUJINTAI TECHNOLOGY CO.,LTD JUKI ESL13044100 BATTERY www.fujintai.com JUKI ESL13053000 CONVEYOR BELT FUJINTAI TECHNOLOGY CO.,LTD JUKI ESL13054000 >> www.fujintai.com JUKI ESL130550A0 NOZZLE FUJINTAI TECHNOLOGY CO.,LTD JUKI ESL13057000 S=SOLENO
Technical Library | 2010-03-18 14:02:03.0
Selecting products that have been qualified by industry standards for use in printed circuit board assembly processes is an accepted best practice. That products which have been qualified, when used in combinations not specifically qualified, may have resultant properties detrimental to assembly function though, is often not adequately understood. Printed circuit boards, solder masks, soldering materials (flux, paste, cored wire, rework flux, paste flux, etc.), adhesives, and inks, when qualified per industry standards, are qualified using very specific test methods which may not adequately mimic the assembly process ultimately used.
Technical Library | 2019-08-14 22:20:55.0
Cleanliness is a product of design, including component density, standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manufacturing process soil, such as flux residue, incompletely activated flux, incompletely cured solder masks, debris from handling and processing fixtures, and incomplete removal of cleaning fluids can hinder the functional lifetime of the product. Contaminates trapped under a component are more problematic to failure. Advanced test methods are needed to obtain "objective evidence" for removing flux residues under leadless components.Cleaning process performance is a function of cleaning capacity and defined cleanliness. Cleaning performance can be influenced by the PCB design, cleaning material, cleaning machine, reflow conditions and a wide range of process parameters.This research project is designed to study visual flux residues trapped under the bottom termination of leadless components. This paper will research a non-destructive visual method that can be used to study the cleanability of solder pastes, cleaning material effectiveness for the soil, cleaning machine effectiveness and process parameters needed to render a clean part.
SMT Auto Aqueous Stencil Cleaning Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCBA Cleaning Machine, On-line PCBA Cleaning Machi
StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.This is a well developed BGA rework method. More on the StencilQuik(TM) process here:
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
SMTnet Express, December 30, 2021, Subscribers: 26,039, Companies: 11,482, Users: 26,994 " ---> Effects of PCB Substrate Surface Finish and Flux on Solderability of Lead-Free SAC305 Alloy The solderability of the SAC305 alloy
| https://www.eptac.com/webinar/hot-topics-solder-mask-bubbles-and-mask-flaking-solder-balls-rohs-cable-coating-and-more/
. Solder mask bubbles, mask flaking and why they may occur. RoHS as it relates to cables and plastic coatings. Course Length: 26 Minutes Cost: FREE Presenter(s): Leo Lambert Download PDF Presentation Watch On Demand More Webinars Flux Classification
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/footprints-for-low-standoff-flux-removal_topic2688_post10971.html
? This is to increase the gap under the component for flux removal during cleaning. It's easy enough to edit the mask by hand for a few components, but it would be nice to automate
