New Equipment | Test Equipment
PROCESS SCIENCES, INC. (PSI) Visit our main Ion Chromatography page for more information. Ion Chromatography analysis (IC) is an essential tool for both failure analysis and process validation. PSI uses IC to investigate surface contamination and m
Electronics Forum | Fri Dec 16 10:25:37 EST 2005 | solderiron
Rather than cleaning a water soluble flux residue off the board, by encapsulating the product. covering the board or the component with lets say a Hysol encasulant. Would this prevent the active flux residue from migrating and deteriorating the elect
Electronics Forum | Fri Jun 25 16:18:26 EDT 2004 | waveroom
For what its worth. Even though you are potting the boards. If for whatever reason flux residue (OA) was left on the board prior to potting this flux could migrate and cause embrittlement problems with the solder joint. I would definately inspect for
Industry News | 2014-10-28 19:14:24.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference scheduled to take place November 18-20, 2014 at the Chicago Marriott in Schaumburg, Illinois.
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
Technical Library | 2022-03-16 19:48:18.0
Dendrites, Electrochemical Migration (ECM) and parasitic leakage, are usually caused by process related contamination. For example, excess flux, poor handling, extraneous solder, fibers, to name a few. One does not normally relate these fails with environmental causes. However, creep corrosion is a mechanism by which electronic products fail in application, primarily related to sulfur pollution present in the air.1 The sulfur reacts with exposed silver, and to a lesser extent, exposed copper. This paper will explore various aspects of the creep corrosion chemical reaction
SMTnet Express, December 29, 2016, Subscribers: 30,326, Companies: 15,062, Users: 41,660 Partially-Activated Flux Residue Impacts on Electronic Assembly Reliabilities Yanrong Shi, Ph.D., Kyle Loomis, Jennifer Allen, Bruno Tolla, Ph.D.; Kester
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2020/10/Reflow-Soldering-2020.pdf
. The company is well-known for its ovens with industry-leading novel catalysts that optimize and heighten operational efficiency, minimize flux maintenance, and lower nitrogen consumption rates
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Tin Whisker Testing and Modeling: Simplified Whisker Risk Model Development Stephen A. McKeown, Dr. Stephan J. Meschter, Polina Snugovsky, and Jeffery Kennedy Abstract 28-1 Pb-Free Flux: A Chemical View of Reliability Phil Isaacs, Eddie Kobeda and Jing
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