New Equipment | Wave Soldering
Economical reciprocating ultrasonic spray fluxing system for medium to high mix lines. Sono-Tek is the originator of ultrasonic spray fluxing for wave solder fluxing. The SonoFlux name is an industry standard for ultrasonic spray fluxing around the
New Equipment | Wave Soldering
Stationary ultrasonic spray fluxing system for low mix/dedicated lines (available in 300mm or 610mm configurations Stationary ultrasonic spray fluxing system for low mix/dedicated lines with medium to high volume. No moving parts mean ultra-low main
Electronics Forum | Mon Sep 24 18:03:43 EDT 2012 | rmazenha
Hi, i am using AIM 264-5 No Clean flux for soldering alpaca pieces on PCB boads, but i am having problems: poor filling and no solder. I am using SAC 305 lead free solder. I have tried to change flux pressure, time, ammount as well solder speed an
Electronics Forum | Thu Jan 19 16:38:39 EST 2012 | dyoungquist
We are not using SN100C in our reflow process but I know the type of flux made a big difference with our SAC305 solder. We started out using no-clean flux in our SAC305 paste and were having some issues. We then switched over to a water soluble flu
Industry News | 2020-03-05 17:49:27.0
-14 colors comply with automotive industry requirements and UL standards -Globally available in small quantities as production ramps up -Connectors needed in next-generation automobiles
Industry News | 2020-08-28 03:07:38.0
ITW EAE is proud to announce that it has earned two Vision Awards for innovative MPM and Electrovert technology developments. MPM received a Vision Award for a new paste monitoring system featuring temperature monitoring as well as upper and lower limit roll-height monitoring. Electrovert received a Vision Award for the new DwellFlex 4.0 variable contact wave solder nozzle. The awards were presented at NEPCON Asia.
Technical Library | 2019-08-07 22:56:45.0
The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are designed to enhance the thermal and electrical performance of the component and ultimately allow the component to run more efficiently. Additionally, low voiding is important in decreasing the current path of the circuit to maximize high speed and RF performances. The demand to develop smaller, more reliable, packages has seen voiding requirements decrease below 15 percent and in some instances, below 10 percent.Earlier work has demonstrated the use of micro-fluxed solder preforms as a mechanism to reduce voiding. The current work builds upon these results to focus on developing an engineered approach to void reduction in leadless components (QFN) through increasing understanding of how processing parameters and a use of custom designed micro-fluxed preforms interact. Leveraging the use of a micro-fluxed solder preform in conjunction with low voiding solder paste, stencil design, and application knowhow are critical factors in determining voiding in QFN packages. The study presented seeks to understand the vectors that can contribute to voiding such as PCB pad finish, reflow profile, reflow atmosphere, via configuration, and ultimately solder design.A collaboration between three companies consisting of solder materials supplier, a power semiconductor supplier, and an electronic assembly manufacturer worked together for an in-depth study into the effectiveness of solder preforms at reducing voiding under some of the most prevalent bottom terminated components packages. The effects of factors such as thermal pad size, finish on PCB, preform types, stencil design, reflow profile and atmosphere, have been evaluated using lead-free SAC305 low voiding solder paste and micro-fluxed preforms. Design and manufacturing rules developed from this work will be discussed.
Technical Library | 2015-07-16 17:24:23.0
Qualification of electronic hardware from a corrosion resistance standpoint has traditionally relied on stressing the hardware in a variety of environments. Before the development of tests based on mixed flowing gas (MFG), hardware was typically exposed to temperature-humidity cycling. In the pre-1980s era, component feature sizes were relatively large. Corrosion, while it did occur, did not in general degrade reliability. There were rare instances of the data center environments releasing corrosive gases and corroding hardware. One that got a lot of publicity was the corrosion by sulfur-bearing gases given off by data center carpeting. More often, corrosion was due to corrosive flux residues left on as-manufactured printed circuit boards (PCBs) that led to ion migration induced electrical shorting. Ion migration induced failures also occurred inside the PCBs due to poor laminate quality and moisture trapped in the laminate layers.
ALPHA® Preforms with solder paste adds solder volume.
Events Calendar | Thu Jun 14 00:00:00 EDT 2018 - Fri Jun 15 00:00:00 EDT 2018 | ,
SMT Process Fundamentals for Tin-Lead and Lead Free Assembly - SMTA Webtorial
Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder As technology becomes increasingly reliant
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/about-us/news/new-nordson-efd-static-mixer-optimizes-mix-performance-3-8-16
New Nordson EFD Static Mixer Optimizes Mix Performance 3-8-16 Nordson EFD Corporate | Global Directory | Languages Division Only All of Nordson Home Products Accessories
Heller Industries Inc. | https://hellerindustries.com/1707mk5-series-convection-reflow-soldering-oven/
× Reflow Oven -1707 Mk5 Best value SMT Reflow Oven in the market. Designed for Low Cost of Ownership. The 1700 reflow oven models support high mix / medium volume throughput
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