LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &
New Equipment | Wave Soldering
The modular system for medium production volumes, to be soldered in ambient atmosphere or with local nitrogen inertion of the solder bath. With the wave soldering system PowerWave, SEHO consequently realized a machine concept that offers a remarkab
Electronics Forum | Tue Aug 23 13:44:46 EDT 2022 | jojoled
Can anybody recomend a (LED-safe) flux removing/cleaning liquid, which can be used in ultrasonic cleaner in immersive application? After using one product I have been told, that none of the top suppliers of chemicals have this kind of liquid (subject
Electronics Forum | Fri Apr 17 21:46:18 EDT 1998 | Matthias Mansfeld
I plan to design a multichip module which contains 1 chip with about 200 pads and 2 chips with about 50 pads, no other components.The whole module shall replace as intermediate solution a single chip CPU in QFP208. Thus, the MCM itself must have t
Used SMT Equipment | Soldering - Wave
ERSA Powerflow N2 XL Wave Solder Machine (2011) Brand: Ersa Model : Powerflow N2 XL Serial #: W039A-11K0015 Year: 2011 Type : Wave Solder Machine Voltage: 400V Power Supply: 3 Phase Exhaust: 800/ 2 x 200m³ Weight: Approx. 3,200 kg CE
Industry News | 2018-10-18 09:23:19.0
CHOOSING A SELECTIVE SOLDERING MACHINE
Industry News | 2021-11-22 07:22:07.0
1 Click SMT Technology Co., ltd is pleased to announce that it received a 2021 GLOBAL Technology Award in the category of Wave Soldering for its new E-THERM NRW Series Lead-Free Wave Soldering Machine. The award was announced during a ceremony that took place Tuesday, Nov. 16, 2021 during productronica in Munich, Germany.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
Technical Library | 2021-11-03 16:49:59.0
Ultrathin bare die chips were soldered using a novel soldering technology. Using homogeneous flash light generated by high-power xenon flash lamp the dummy components and the bare die NFC chips were successfully soldered to copper tracks on polyimide (PI) and polyethylene terephthalate (PET) flex foils by using industry standard Sn-Ag-Cu lead free alloys. Due to the selectivity of light absorption, a limited temperature increase was observed in the PET substrates while the chip and copper tracks were rapidly heated to a temperatures above the solder melting temperature. This allowed to successfully soldered components onto the delicate polyethylene foil substrates using lead-free alloys with liquidus temperatures above 200 °C. It was shown that by preheating components above the decomposition temperature of solder paste flux with a set of short low intensity pulses the processing window could be significantly extended compared to the process with direct illumination of chips with high intensity flash pulse. Furthermore, it was demonstrated that with localized tuning of pulse intensity components having different heat capacity could be simultaneously soldered using a single flash pulse.
High speed, in-line, multi-platform selective soldering system Incorporating high-speed PCB transfer, the Orissa Fusion platform offers the ultimate in flexibility, coupled with reduced line length at a lower cost compared to current market offering
High speed, in-line, multi-platform selective soldering system Incorporating high-speed PCB transfer, the Orissa Fusion platform offers the ultimate in flexibility, coupled with reduced line length at a lower cost compared to current market offering
| https://www.smtfactory.com/I-C-T-Lyra622N-Lead-free-SMD-Dual-Rails-Reflow-Soldering-Oven-Machine-pd46059734.html
I.C.T-Lyra622N | Lead-free SMD Dual Rails Reflow Soldering Oven Machine from China manufacturer - I.C.T SMT Machine English Türk dili Tiếng Việt 한국어 日本語 Italiano Deutsch
GPD Global | https://www.gpd-global.com/co_website/fluiddispense-appsol-wafer.php
. Example of a Wafer component. Wafer Fixturing in Stand-alone System. For automated processing, we can interface with our wafer handling system to feed wafers, with or without frames, directly from magazines
