Electronics Forum | Fri Jun 01 16:22:35 EDT 2001 | davef
Your supplier�s approach to managing process change is TOTALLY UNACCEPTABLE!!!! Now, let me get the froth back in my mouth. How in the world do we know if the residues on these "no-clean" boards are compatible with your product? J-STD-001C, para 4
Electronics Forum | Mon Jul 25 18:54:10 EDT 2005 | Brian
Exactly. We bring the paste apertures closer together, so that the part sits more in the center of the paste. As a CM, our customers do not always accept our recommended design changes, so we use this method to reduce our tombstoning if the pad geo
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Industry News | 2014-09-06 17:51:35.0
IPC — Association Connecting Electronics Industries® has released the F revisions of two of the industry’s most widely used standards, IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability of Electronic Assemblies.
Industry News | 2018-10-11 19:15:17.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place November 13-15, 2018 at Chicago Marriott, Schaumburg, Illinois. The conference is focused on the cleanliness of highly dense electronic assemblies to achieve quality and reliability within the stated in-field environment.
Technical Library | 2018-11-20 21:33:57.0
There are several industry-accepted methods for determining the reliability of flux residues after assembly. The recommended methods of test sample preparation do not always closely mimic the thermal cycle experienced by an assembly. Therefore, extraction from actual assemblies has become a popular method of process control to assess consistency of post-reflow cleanliness. Every method of post-reflow flux residue characterization will depend on the reflow process followed to prepare the coupon.This investigation will focus on the effect of thermal conditions on the remainder of active ingredients in flux residues after assembly with no-clean solder pastes.
Technical Library | 2020-11-24 23:01:04.0
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. The paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosivity with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.
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. IPC classification is usually ROL0, ROL1, ROM0, or ROM1. RMA flux residue is clear and soft. Most are non-corrosive and non-conductive
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Heller-Frost-and-Sullivan-2013-Award.pdf
solutions ahead of the competition. Handling of flux is among the top challenges for customers. Flux is a component that comes from solder paste. It can also leave residue that drips on the circuit board and within the oven. The company has developed a
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