Petroferm has the solution for removal of post reflow residues from every available solder paste and flux. Petroferm offers a complete line of aqueous, semi-aqueous, and solvent defluxing chemistries for use in every brand and style of cleaning equip
New Equipment | Cleaning Agents
IONOX® I3955 is a precision vapor cleaning solvent designed as a drop in replacement for modern era vapor degreasing equipment. IONOX® I3955 is effective in removing no clean and rosin flux residues from electronic assemblies including low stand-off
Electronics Forum | Fri Nov 03 09:31:35 EDT 2017 | davef
On the flux reside issue that is gumming up your test probe pogos ... Short term, clean what's in process with a aerosol flux cleaner solvent. Ask your flux supplier for recommendations. Longer term, recognizing that there is no fix, your improveme
Electronics Forum | Fri Nov 03 15:43:20 EDT 2017 | dleeper
IPA and DI water are both very common and effective methods of cleaning PCBAs. http://www.zestron.com/sa/cleaning-applications/smt-electronic-cleaning/pcba-cleaning/aqueous-cleaning.html http://blog.gotopac.com/2010/11/18/ipa-as-a-universal-cleaner
Industry News | 2017-10-05 05:56:21.0
The SMTA Capital Chapter is pleased to announce its third meeting of 2017 on November 7th, scheduled from 5:30 pm to 8:00 pm at ZESTRON Americas, 11285 Assett Loop, Manassas, VA, 20109. Ravi Parthasarathy, Senior Application Engineer, ZESTRON Americas, will present “Cleaning Before Conformal Coating” and “pH Neutral Cleaning Agents - Market Expectation and Field Performance”.
Industry News | 2008-09-02 17:41:24.0
ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Dr. Bill Kenyon will moderate a collaborative panel discussion on cleaning fluid designs. The panelists will comprise industry experts including Dr. Ken Dishart formerly of DuPont, Karl Manske of 3M, Tom Tattersall of MicroCare, Kyle Doyel of Kyzen, Dr. Harald Wack of Zestron, and Dr. Jay Soma of Petroferm. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.
Technical Library | 2016-12-29 15:37:51.0
The reliabilities of the flux residue of electronic assemblies and semiconductor packages are attracting more and more attention with the adoption of no-clean fluxes by majority of the industry. In recent years, the concern of "partially activated" flux residue and their influence on reliability have been significantly raised due to the miniaturization along with high density design trend, selective soldering process adoption, and the expanded use of pallets in wave soldering process. When flux residue becomes trapped under low stand-off devices, pallets or unsoldered areas (e.g. selective process), it may contain unevaporated solvent, "live" activators and metal complex intermediates with different chemical composition and concentration levels depending on the thermal profiles. These partially-activated residues can directly impact the corrosion, surface insulation and electrochemical migration of the final assembly. In this study, a few application tests were developed internally to understand this issue. Two traditional liquid flux and two newly developed fluxes were selected to build up the basic models. The preliminary results also provide a scientific approach to design highly reliable products with the goal to minimize the reliability risk for the complex PCB designs and assembly processes. This paper was originally published by SMTA in the Proceedings of SMTA International
Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.
SMTnet Express, June 15, 2017, Subscribers: 30,470, Companies: 10,610, Users: 23,373 Nondestructive Inspection of Underfill Layers Stacked up in Ceramics-Organics-Ceramics Packages with Scanning Acoustic Tomography (SAT) Flex International
Article Return to Front Page No-Residue Technolo
| https://www.smtfactory.com/I-C-T-SS540-On-line-Selective-Wave-Soldering-Machine-pd48693093.html
function is optional. 2. It is configuration with tray under the jet valve to catch the flux residue for easy maintenance. 3. The nozzle is mounted on the XY platform, the accuracy of repetition and positioning can reach 0.02mm. Features 2 Preheat system： 1
Heller Industries Inc. | https://hellerindustries.com/fluxless-soldering/
. If not cleaned properly flux residue can become acidic and diminish the reliability of the device. For flip chip and BGA applications, flux residue has the potential be trapped between interconnects, blocking underfill flow
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
