Industry Directory | Manufacturer
Aoki Laboratories Ltd. is an ISO-9002 certified company specializes in manufacturing of Sn/Pb Bar Solder, Cored Wire and Paste.Environmental friendly products, such as: lead-free solder, no-clean non-halide solder flux, no-clean cored wire and Non-CFC cleaner, are compliance with ISO-14001 requirements.
Industry Directory | Manufacturer
Nitrogen Cast Lead Free solder Manufacturer, complete range of No Clean and No Residue fluxes Misprint Cleaning Systems completely compressed air driven low cost with no need for electrics 18x12
New Equipment | Rework & Repair Equipment
The new inspection mirror meets clean room requirements yet is sufficiently economical for non-clean room applications. A quality tool for the technician but inexpensive enough to meet the budgetary requirement of modern manufacturing. Economical Br
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
Used SMT Equipment | Board Cleaners
Aqueous Tech Trident 111 Must sell posted 5/5/15 208V 3 phase 40 Amps Year 2008 Trident III is capable of removing all flux residues including rosin, no-clean and water soluble. Both lead and lead-free flux residues may be removed using the
Used SMT Equipment | Board Cleaners
Aqueous Technologies Trident III Cleaning System SKU 16561 : For pricing or questions please call or email us • Refurb 2025 • Environmentally Responsible Fully Automated Cleaning System • Optional Zero Discharge * &
Industry News | 2012-05-11 20:35:45.0
Heller Industries has been awarded a 2012 SMT VISION Award in the category of Soldering Reflow for its 1936 Mark 5 Reflow Oven. The award was presented on April 25, 2012 at the Nepcon China Exhibition.
Industry News | 2003-06-05 08:11:23.0
Kerry co-solvent system pays for itself in 13 months
Technical Library | 2020-11-24 23:01:04.0
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. The paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosivity with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.This is a well developed BGA rework method. More on the StencilQuik(TM) process here:
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Apr 13 18:30:00 UTC 2020 - Mon Apr 13 18:30:00 UTC 2020 | ,
Why Are We Cleaning No-Clean?
Events Calendar | Tue Apr 20 18:30:00 UTC 2021 - Tue Apr 20 18:30:00 UTC 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
SMTnet Express, October 31, 2024, Subscribers: 25,883, Companies: 12,299, Users: 29,317 █ Electronics Manufacturing Technical Articles Failure Analysis - Using Ion Chromatography And Ion Chromatography/Mass Spec (IC/MS) Since the 1980
| https://www.eptac.com/webinar/flux-classification-part-2-selecting-the-right-flux-for-your-application/
. This Webinar will provide you with a brief insight into: The Purpose of Flux Impact of Flux Residue Selection and Qualification Process Flux Performance Specifications Course Length: 44 Minutes Cost: FREE Presenter(s
| https://pcbasupplies.com/leaded-solder-wire/
levels Clear flux residue offers superior cosmetics No Clean Leaded Flux Cored Solder Wire JM-20 Sn63/Pb40 Specs Product Name Solder Wire JM20 Sn60 Pb40 Product Category Solder Wire Flux content (%) 1.0 - 3.0 Halide content
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