Flux application using the DispenseJet® pump is a superior alternative to screen printing and ultrasonic spray. Jet dispensing eliminates the overspray and material waste associated with ultrasonic and spray application methods. Flux application usi
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Circuit Board PCBA Washing Machine PCBA Cleaning Equipment 380V Power Supply Description: This machine is an integration of high-end cleaning machine,with energy-saving environmental protection, bulk cleaning, it can complete the cleaning, rinsin
Electronics Forum | Tue Sep 02 14:59:41 EDT 2008 | hermes
if two boards with different solder masks give different results on flux residue level after soldering with the exact same machine settings than it is clear that one of the solder masks is not compatible with your no-clean flux. could be the solder m
Electronics Forum | Thu Aug 28 09:30:20 EDT 2008 | patrickbruneel
Omid, No-clean fluxes need to be used right out of the can without thinning. In the past with RA and RMA fluxes you could adjust or thin them to your desired density because they had plenty of solids up to 30%. No-Clean fluxes have a lot lower solid
Industry News | 2018-10-18 09:20:09.0
Product defects caused by the flux in the wave soldering process
Industry News | 2016-09-15 18:08:04.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.
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The definition of SMT SMT is the surface assembly technology,surface mount technology(surface mount technology)(Surface Mounted Technology abbreviation),is currently the most popular electronic assembly industry,a technology and technology. What a
Technical Library | 2023-04-17 21:17:59.0
The purpose of this paper is to evaluate and compare the effectiveness and sensitivity of different cleanliness verification tests for post soldered printed circuit board assemblies (PCBAs) to provide an understanding of current industry practice for ionic contamination detection limits. Design/methodology/approach – PCBAs were subjected to different flux residue cleaning dwell times and cleanliness levels were verified with resistivity of solvent extract, critical cleanliness control (C3) test, and ion chromatography analyses to provide results capable of differentiating different sensitivity levels for each test. Findings – This study provides an understanding of current industry practice for ionic contamination detection using verification tests with different detection sensitivity levels. Some of the available cleanliness monitoring systems, particularly at critical areas of circuitry that are prone to product failure and residue entrapment, may have been overlooked. Research limitations/implications – Only Sn/Pb, clean type flux residue was evaluated. Thus, the current study was not an all encompassing project that is representative of other chemistry-based flux residues. Practical implications – The paper provides a reference that can be used to determine the most suitable and effective verification test for the detection of ionic contamination on PCBAs. Originality/value – Flux residue-related problems have long existed in the industry. The findings presented in this paper give a basic understanding to PCBA manufacturers when they are trying to choose the most suitable and effective verification test for the detection of ionic contamination on their products. Hence, the negative impact of flux residue on the respective product's long-term reliability and performance can be minimized and monitored effectively.
Technical Library | 2018-08-29 21:17:53.0
No-clean solder pastes are widely used in a number of applications that are exposed to wide variations in temperature during the life of the assembled electronics device. Some have observed that cracks can and do form in flux residue and have postulated that this is the result of or exacerbated by temperature cycling. Furthermore, the potential exists for the flux residue to soften or liquefy at elevated temperatures, and even flow if orientated parallel to gravity. In situations such as in automotive electronics, where significant temperature cycling is a reality and high reliability is a must, concern sometimes exists that the cracking and possible softening or liquefying of the residue may have a deleterious effect on the electrical reliability of the flux residue. This paper will attempt to address this concern.
Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.
Camera Module Cleaning Machine ETA-C800 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCBA Cleaning Machine, On-line PCBA Cleaning Machine
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Article Return to Front Page No-Residue Technolo
SMTnet Express, November 5, 2020, Subscribers: 28,030, Companies: 11,176, Users: 26,227 Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection? Credits: ZESTRON OEMs and CMs designing and building electronic
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/flux.pdf
Flux PROPRIETARY AND CONFIDENTIAL INFORMATION NOT FOR REPRINT OR DISTRIBUTION Heller Industries Project Title: Condenser Tube Air Flux System Doc Number: F-404-005 Pages: 1 of 11 Rev Level: 1 Rev Date: 5/03/99 Project No
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/microdrop-flux-dispenser
specific locations without overspray - Ideal for micro flux deposition of flux to small solder sites with unparalleled accuracy and minimal flux consumption - Provides true no-clean processing since flux is
