Industry Directory | Consultant / Service Provider / Distributor / Manufacturer / Other
West Coast Magnetics serves global leaders in the medical, defense, and many more industries.
Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer
Manufacturer of soldering materials since 1999. Our products include reflow oven ,solder machines, fluxes and AOI.
Hanwha Decan S2 SMT Assembly line Decan S2 SMT Assembly Line Decan S2 SMT Assembly Line SMT PCB production Full Automatic Assembly line Speed:158000CPH Product description: Hanwha Decan S2 SMT Assembly line, Speed 158000CPH INQUIRY Ha
Dual Lane SMT Reflow Oven Nitrogen soldering process dual rail conveyor Weight Appx.:3060Kg Dimension 6300*1680*1530mm Product description: 10 Zones Dual Rail Nitrogen SMT Reflow Oven KTR-1000D-N Manufacturer, Nitrogen soldering process, dual
Electronics Forum | Fri Sep 08 12:03:24 EDT 2017 | rameshraja
Hi, I need the RF 800 Flux Acid titration procedure and also require EPT of the same to add thinner ( RF 800 additive), i.e we are using the flux rf 800 for our wave soldering process having foam fluxer , after 2 hours we are taking sample from the
Electronics Forum | Tue Feb 19 08:49:34 EST 2008 | rgduval
Get the ionic specs from your flux manufacturer, and show it to the designer. No-clean flux/solder is supposed to be low to minimal in ionic contamination, which allow the whole no-clean thing. If he needs further proof, you can have the board io
Used SMT Equipment | Soldering - Reflow
Senju SNR-825 Reflow Oven Serial Nr: 3207043 Manufactured Year: 2009 Board Counter: 85499 Direction: Left to Right Lead Free Heating Zones: 8 Zones, Top and Bottom Cooling Zone: 1 Zone, Water Cool Conveyor Speed: 0.3 – 2.0 m/min
Used SMT Equipment | SMT Equipment
Auction: Phoenix X-Ray PCB Analyser, Wafer Probers, Test Chambers, Hot Bar Bonders, Dicing Saws & More Featuring: BAE - Manassas, Virginia USA • V.J. Technologies VJ-1000 X-Ray System A World Class Semiconductor Mfg. Co. - Hayward, California USA
Industry News | 2003-03-14 08:39:42.0
The company's professional PCB design portfolio is available for approximately $4,000 to $10,000 (U.S.)--by far, the best price/performance in the industry.
Industry News | 2003-05-06 09:05:12.0
New Schematic Capture and Simulation Software Delivers Innovative Features and the Industry�s Best Price/Performance
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Parts & Supplies | Pick and Place/Feeders
JUKI RS-1 RF feeder storage cart for all electronic feeders Specification Dimension: 800 x 700 x 1070 mm, L x W x H Material: stainless steel Structure: 2 layers, 40pieces per layer, with four metal flexible castors Features 1.The fee
Parts & Supplies | Assembly Accessories
SMT MACHINE SPARE PARTS JUKI MTS X Y STEPPING MOTOR DRIVER 40045711 FS1W075P24 Specifications: Brand Name JUKI MTS X Y STEPPING MOTOR DRIVER 40045711 FS1W075P24 Part number 40045711 Model FS1W075P24 Ensure Test in machine confirmation Gua
Technical Library | 2021-10-20 18:21:06.0
The solderability of the SAC305 alloy in contact with printed circuit boards (PCB) having different surface finishes was examined using the wetting balance method. The study was performed at a temperature of 260 _C on three types of PCBs covered with (1) hot air solder leveling (HASL LF), (2) electroless nickel immersion gold (ENIG), and (3) organic surface protectant (OSP), organic finish, all on Cu substrates and two types of fluxes (EF2202 and RF800). The results showed that the PCB substrate surface finish has a strong effect on the value of both the wetting time t0 and the contact angle h. The shortest wetting time was noted for the OSP finish (t0 = 0.6 s with EF2202 flux and t0 = 0.98 s with RF800 flux), while the ENIG finish showed the longest wetting time (t0 = 1.36 s with EF2202 flux and t0 = 1.55 s with RF800 flux). The h values calculated from the wetting balance tests were as follows: the lowest h of 45_ was formed on HASL LF (EF2202 flux), the highest h of 63_ was noted on the OSP finish, while on the ENIG finish, it was 58_ (EF2202 flux). After the solderability tests, the interface characterization of cross-sectional samples was performed by means of scanning electron microscopy coupled with energy dispersive spectroscopy.
Technical Library | 2019-08-07 22:56:45.0
The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are designed to enhance the thermal and electrical performance of the component and ultimately allow the component to run more efficiently. Additionally, low voiding is important in decreasing the current path of the circuit to maximize high speed and RF performances. The demand to develop smaller, more reliable, packages has seen voiding requirements decrease below 15 percent and in some instances, below 10 percent.Earlier work has demonstrated the use of micro-fluxed solder preforms as a mechanism to reduce voiding. The current work builds upon these results to focus on developing an engineered approach to void reduction in leadless components (QFN) through increasing understanding of how processing parameters and a use of custom designed micro-fluxed preforms interact. Leveraging the use of a micro-fluxed solder preform in conjunction with low voiding solder paste, stencil design, and application knowhow are critical factors in determining voiding in QFN packages. The study presented seeks to understand the vectors that can contribute to voiding such as PCB pad finish, reflow profile, reflow atmosphere, via configuration, and ultimately solder design.A collaboration between three companies consisting of solder materials supplier, a power semiconductor supplier, and an electronic assembly manufacturer worked together for an in-depth study into the effectiveness of solder preforms at reducing voiding under some of the most prevalent bottom terminated components packages. The effects of factors such as thermal pad size, finish on PCB, preform types, stencil design, reflow profile and atmosphere, have been evaluated using lead-free SAC305 low voiding solder paste and micro-fluxed preforms. Design and manufacturing rules developed from this work will be discussed.
Separate precise SMD thin board, aluminum PCB, copper PCB, RF4, fiberglass PCB and T5T8 light. For special board ,needs customization. If you have any question, just feel free to contact e-mail: bella@qy-smt.com or browse Website?https://morel-equi
Separate precise SMD thin board, aluminum PCB, copper PCB, RF4, fiberglass PCB and T5T8 light. For special board ,needs customization. If you have any question, just feel free to contact e-mail: bella@qy-smt.com or browse Website?https://morel-equi
Events Calendar | Wed May 10 00:00:00 EDT 2017 - Wed May 10 00:00:00 EDT 2017 | Itasca, Illinois USA
Kester to Host Technical Rework Seminar
Career Center | Fort Mill, South Carolina USA | Engineering,Maintenance,Research and Development
Have serviced AMF pinspotters both mechanical and electrical sides; included repair of chassis pc boards to component level. 20 years in this field. Have worked in PCB manufacture with old style board populators and Panasert robots Worked in H
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/es-ES/divisions/efd/products/solder-paste/fluxplus-paste-flux
| Nordson EFD Inicio Tipo de producto Productos de soldadura FluxPlus Pasta Flux En México llame sin costo al 001-800-556-3484 En España llame +34 620 959 023 Necesitan
| https://unisoft-cim.com/solder.php
PCB Selective Soldering Machine Programming Software ( flux / solder files) Thru-hole THD | Unisoft ≡ Menu Skip navigation For over 35 years, Intelligent PCB Manufacturing Automation Software Be production ready in minutes, not days
