Industry Directory | Manufacturer
Suppliers of all equipment and materials used in manufacture of smt stencils. Lasers, optical inspection systems, 304 Stainless foil, Invar, Alloy 42, 29" x 29" x 1/2" Space Saver Frames, 23" x 23" x 1/2" Space Saver Frames, Aluminum frames, prestretched frames, epoxy adhesives, polyester fabric, blockout tape, and squeegee.
Industry Directory | Manufacturer
We recently got a MPM SP2000 screen printer and would like to source screen frames (stencil adapters) for a square with between 17 to 23 inch sides, squeegee holders (we have an 8-inch, would like larger, up to 12-inch) and sources for artwork on stretched screens. Also seeking a manual for the SP2000 (S/N 3511) or related beast.
2.0 Cmk @ ± 25 μmProduct description: DEK E Seriels SMT Stencil Printer E by DEK, core cycle time: 8 seconds, Substrate size: 620 mm (X) x 508.5 mm (Y), System alignment capability: > 2.0 Cmk @ ± 25 μm DEK E SMT Stencil Printer DEK E SMT Stenc
New Equipment | Solder Paste Stencils
SMT Foil Stencils are laser cut solder paste stencils designed to work on their own for hand printing or with stencil tensioning systems. These laser cut stencils do not need to be permanently glued in a frame. These so-called frameless stencils are
Electronics Forum | Sun Mar 07 13:10:15 EST 1999 | Sam Sangani
| Has anyone used the mechanical stencil foil tensioning system from certain company that eliminates using stencil frames and epoxy & mesh? Any comments on whether it's worth looking into? We go through product revisions like we go through clean so
Electronics Forum | Thu May 03 10:23:33 EDT 2001 | davef
Yes, Alpha's frames help develop upper body strength. All stencils, regardless of the type of frame, can have loose foils. Stencils with removable foils require a specialized storage system for the foils and lots of band-aids. Some foil frame su
Used SMT Equipment | Pick and Place/Feeders
MC389CY-F3-V MC-389 High-Speed, High-Mix Pick & Place WITH CONVEYOR Heavy-duty, welded steel base frame w/ adjustable foot pads High-precision ball screw X-Y drive mechanism w/ linear encoders Three pick and place heads, each with servo-drive
Used SMT Equipment | Pick and Place/Feeders
Heavy-duty, welded steel base frame w/ adjustable foot pads High-precision ball screw X-Y drive mechanism w/ linear encoders Three pick and place heads, each with servo-driven Z- and ?-axis motors Standard on-the-fly vision alignment cameras for c
Industry News | 2003-06-10 08:39:25.0
New from Unitek Eapro is a series of desktop systems for hot bar bonding applications.
Industry News | 2016-08-23 16:25:55.0
The SMTA and Chip Scale Review magazine are pleased to announce the Workshops for the 13th Annual International Wafer-Level Packaging Conference (IWLPC). On Thursday, October 20, there will be professional workshops given by instructors who are pre-eminent authorities in their fields. IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.
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Parts & Supplies | Pick and Place/Feeders
00326041-01 SONAR PROXIMITY SWITCH INPUT BELT 2 00326042-01 Sonarbero 00326043-01 SONAR PROXIMITY SWITCH OUTPUT BELT 2 00326044-03 Bero Stopper 2 00326056S04 MOTOR WIDTH ADJUSTMENT 2 00326058S01 MOTOR LIFTING TABLE 2 00326068-01 CABL
Parts & Supplies | Screen Printers
Part Number Description Part Number Description 156476 248/249/260 ADAPTER, IMP. SCALE 1A311:B31956270 END SHIELD 156475 248/249/260 ADAPTER, METRIC SCALE 163172 NUT PLATE, Z-BKT 156442 CHASE ADAPTER
Technical Library | 2023-08-04 15:38:36.0
The MicroLeadFrame® (MLF®)/Quad Flat No-Lead (QFN) packaging solution is extremely popular in the semiconductor industry. It is used in applications ranging from consumer electronics and communications to those requiring high reliability performance, such as the automotive industry. The wide acceptance of this packaging design is primarily due to its flexible form factors, size, scalability and thermal dissipation capabilities. The adaptation and acceptance of MLF/QFN packages in automotive high reliability applications has led to the development of materials and processes that have extended its capabilities to meet the performance and quality requirements. One of process developments that is enabling the success of the MLF/QFN within the automotive industry has been the innovation of side wettable flanks that provide the capability to inspect the package lead to printed circuit board (PCB) interfaces for reliable solder joints. Traditionally, through-board X-ray was the accepted method for detecting reliable solder joints for leadless packages. However, as PBC layer counts and routing complexities have increased, this method to detect well-formed solder fillets has proven ineffective and incapable of meeting the inspection requirements. To support increased reliability and more accurate inspection of the leadless package solder joints, processes to form side-wettable flanks have been developed. These processes enable the formation of solder fillets that are detectable using state-of-the-art automated optical inspection (AOI) equipment, providing increased throughput for the surface mount technology (SMT) processes and improved quality as well.
00375200-01 Retrof.kit Discharge Choke Coil, HS50-60 00375245-01 SPARE PART KIT X-DRIVE FOR HF UNTIL S-NR. 00375273-01 Cable abrasion protection foil 00375274-01 Cable abrasion protection foil 00375276-01 Cable abrasion protection foil 300mm 003
03018616S01 Koplan optoNCDT ILD 2200-3 03018629-01 AIR FILTER HOUSING 03018635-01 COOLING AIR FILTER 03018637S02 COMPONENT-CAMERA C+P(Type29) 27x27 digital 03018820S01 BOLT/COVER STRIP DISPOSAL X24 03018844S01 BOLT/COVER STRIP DISPOSAL X32 0301
SMTnet Express, August 16, 2018, Subscribers: 31,259, Companies: 11,015, Users: 25,092 Reliable Young's Modulus Value of High Flexible, Treated Rolled Copper Foils Measured by Resonance Method Kazuki Kammuri, Atsushi Miki, Hiroki Takeuchi; JX
SMTnet Express, July 7, 2016, Subscribers: 25,539, Companies: 14,860, Users: 40,631 Dissolution of Metal Foils in Common Beverages Bev Christian, Nancy Wang, Mark Pritzker, Daniella Gillanders, Gyubok Baik, Weiyi Zhang, Joanna Litingtun, Brian Kim
KD Electronics Ltd. | http://www.kundasmt.com/?A-Equipment-Accessories/6010.html
FEEDER locking device 30/2 slots 03081674-01 GUIDE PROFILE L=150mm 03081718S01 conversion board cpl. 03081876S02 tamp wheel cpl. Z=44 X16 N 03081908S02 deflector rocker X12/X16 V2 03081927-01 Montageschluessel Imbus Kopfkameras 03081962-01 Cable splice sensor X12/X16 V2 03081975-02 Centering bar 60/2 slots 03081997S02 flap foil disposal X12 V2 cpl
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/products/bonding-and-soldering-systems/c-prime
. All kind LCD, Flex foil and PCB connections can be made using these systems. Nordson DIMA has the most intelligent systems designs, very rigid base constructions with exchangeable soldering/bonding heads which minimizes your production down time when switching over to another
