Industry Directory | Consultant / Service Provider / Manufacturer
One of the major suppliers of stencils and pallets to the SMT industry. Stentech offers Electroformed and laser cut stencils, pallets and fixtures.
2.0 Cmk @ ± 25 μmProduct description: DEK E Seriels SMT Stencil Printer E by DEK, core cycle time: 8 seconds, Substrate size: 620 mm (X) x 508.5 mm (Y), System alignment capability: > 2.0 Cmk @ ± 25 μm DEK E SMT Stencil Printer DEK E SMT Stenc
New Equipment | Education/Training
IPC standards, the results of industry consensus and collaboration, are respected throughout the whole world. Using IPC standards allows manufacturers, customers and suppliers to speak the same language. IPC standards are used by the electronics
Electronics Forum | Thu Jan 09 11:15:12 EST 2020 | cyber_wolf
Stencil lifespan depends on several factors such as squeegee type, squeegee pressure, handling,and foil thickness to name a few. There is no magic number. The best judge is your SPI machine if you have one. We typically start thinking about replacem
Electronics Forum | Thu Jan 09 15:06:45 EST 2020 | emeto
From what I have seen it will be based on thickness, material and usage. Sometimes will be product dependent if the you have a marginal process. We used to change stencils every 2-3weeks for a high runner. Other than that follow Sr.Tech's advice.
Used SMT Equipment | Screen Printers
DEK Horizon 03iX Fully Automatic Screen Solder Paste Printer Model Horizon 03iX Operating System Win XP+09sp13 or up PCB support Tooling&n
Used SMT Equipment | Screen Printers
DEK Horizon 03iX SMT Printer Model Horizon 03iX Operating System Win XP+09sp13 or up PCB support Tooling Magnetic tooling pins Camera type Hawkeye 750 or Hawkeye 1700 (optional) 198040 198043 hawkeye Board foil clamp siz
Industry News | 2003-07-09 09:11:37.0
Release of the first revision to the standard that forms the foundation of IPC�s family of design standards (IPC-2220)
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Parts & Supplies | Assembly Accessories
Minifigures (As sample. No commercial value) SERVO AMPLIFIER TDS120A3Z-01 003012565S01 SERVO AMPLIFIER BOARD 00337626-04 SERVO AMPLIFIER 00344204-04 SERVO AMPLIFIER PC-BOARD TBS200/15Y-02 00344205S04 Servo Amplifier
Parts & Supplies | Assembly Accessories
Grease oil MGREAS400G0 OIL FILTER ELEMENT AFM30P-060S Oil Seal (TCV305011 ) AP1709A Oil Seal ( SC224211 ) AC1148A Metal foil low resistance chip resistors KRL2012E-C-R010-F-T1 Polyurethane coil tube UC-04-25
Technical Library | 2014-03-13 15:25:01.0
A student competition paper at Budapest University of Technology And Economics, Department of Electronics Technology gives background, covers stencil design and discusses stencils intended for pin in paste application. The stencil applied for depositing the solder paste is a thin, 75–200 µm thick metal foil, on which apertures are formed according to the solder pads on the printed circuit board. Stencil printing provides a fast, mass solder paste deposition process; relatively expensive, appropriate and recommended for mass production.
Technical Library | 2017-11-22 12:38:51.0
The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described[1] an approach to very thin copper laminates of coating uniform layers of nano copper inks and converting them into conductive foils via photonic sintering with a multibulb conveyor system, which is consistent with roll-to-roll manufacturing. The copper thickness of these foils can be augmented by electroplating. Very thin copper layers enable etching fine lines in the flexible circuit. These films must adhere tenaciously to the polyimide substrate.In this paper, we investigate the factors which improve and inhibit adhesion. It was found that the ink composition, photonic sintering conditions, substrate pretreatment, and the inclusion of layers (metal and organic) intermediate between the copper and the polyimide are important.
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
foils laminated to polyimide (PI) as flexible pri
ORION Industries | http://orionindustries.com/pdfs/X700-series.pdf
. to the International Organization for Standardization, ISO 9002 Standard for Quality. Foil Foil Nom Thk UL94 Flame* RTI Mtl Dsg Col Type Thickness (In
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/news/news/2015-01-05
Die on an Existing Coating Line, Thickness Tolerances Were Narrowed by 50 to 60% CHUNGBUK, SOUTH KOREA, January 5, 2015: An advanced extrusion coating die designed to reduce edge bead has enabled one leading producer of aluminum foil and foil-laminate flexible packaging to actually eliminate edge bead, as well as
