We are a electro-mechanical contract manufacturer located in Penang, Malaysia. We specialise in project management for box built products from pilot run to actual mass production. We are able to provide design assistance in all mechanical requirement
Industry Directory | Manufacturer
We are a ISO-9001 certified full service company in the field of electronics since 1996. We manufacture electronic components and devices and develop electronics according to your needs.
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
Used SMT Equipment | Soldering - Reflow
BTU Pyramax 125N Parameters Pyramax Specifications Model Pyramax 125N Atmosphere Air or Nitrogen Conveyor Speed 10-60 in/min 25-152 cm/min Conveyor Width 2-18 in 51-457 mm Heated Length 125 in 3175 mm Heated Zones&
Used SMT Equipment | Soldering - Reflow
T300 Conveyor Hot-air Reflow Oven Conveyor Hot-air Reflow Oven has (3) heating zones and (300mm) wide and (1200mm) long conveyor for low to medium volume production runs. T300 utilizes PID intelligent micro-computer automatic temperature cont
Industry News | 2009-02-02 18:48:47.0
Henkel today announced the appointment of Mr. Luc Godefroid as the company's Global Sales Director for its Semiconductor Group. A key member of Henkel's electronics sales team since 2001, Godefroid's new role sees him building on his previous success and directing the global sales efforts of Henkel's worldwide team and expanded product portfolio.
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-08-16 18:13:53.0
In one of our Consumer Electronics projects, a smart lighting company wished to dispense silicone-based LED encapsulation material for two different product sizes. The larger product had a 9mm circular dam which required silicone dispensing flush with the top of the dam. The smaller product had a 1mm LED die that required only the top to be encapsulated. The material consisted of two parts which were mixed by weight in a 1:1 ratio. A phosphor powder was added totaling 10% of the overall weight. The phosphor required agitation to remain suspended.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
This video demonstrated the use of BEST Inc HotDots(TM) which allow wires to be affixed to the PCB or other surfaces-even when those surfaces go through reflow. There are other similar products out there but none of which can be readily customized no
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Mon Aug 10 18:30:00 UTC 2020 - Mon Aug 10 18:30:00 UTC 2020 | ,
SMTA/iNEMI Webinar: Non-Contact Additive Processes for Contemporary Electronics Production
Events Calendar | Mon Jun 08 18:30:00 UTC 2020 - Mon Jun 08 18:30:00 UTC 2020 | ,
Critical Environmental Requirements for Electronics Conference
Career Center | Buffalo, New York USA | Engineering,Production,Quality Control,Technical Support
The Process Engineer will lead overall improvement in the area of yield enhancement, reduction in non-conforming components and assemblies, as well as cost saving initiatives. An important attribute of this position is the use of SPC for variation i
Career Center | Auckland, New Zealand | Engineering
NAVMAN PCBA NPI Engineer Reporting To: PCBA NPI Technical Leader Primary Objective: Transition of PCBs from R&D design to a manufacturable state conforming to all facets of PCBA production Secondary: Develop DFM & best practice guidelines Res
Career Center | Elma, New York USA | Engineering,Management,Production,Technical Support
Over ten years of solid experience in electronic printed circuit board (PCB) assembly as a Manufacturing Engineer/Technician. In addition to Microsoft's office 2000 and NT workstation, I have demonstrated skills and proficiency in the following areas
Career Center | Toronto, Ontario Canada | Engineering,Maintenance,Production,Technical Support
Maintenance engineer for more than 7 years in SMT such as Panasonic MV2E, MSH G1, MV100, MK2,SPPV Printer, etc.. MPM UP series Printer, Vitronics Reflow and BTU Reflow Oven, Fuji CP6, KME machines, Mydata and others. I handled programming and major
Lewis & Clark | http://www.lewis-clark.com/product-tag/pilot/
: Pilot S20 Condition: First Unit Operational when taken offline, Second unit for parts machine Location & Shipping: USA/ FOB Origin Availability
| https://productronica.com/en/trade-fair/
Trade Fair for Electronics Development and Production DE Deutsch English Discover productronica Trade fair topics PCB & EMS SMT Cables, Coils
