Electronics Forum | Thu Aug 24 12:56:48 EDT 2006 | ultranix
Thanks for your valuable advice. Rdgs CKH
Electronics Forum | Thu Aug 24 12:45:16 EDT 2006 | CKH
Hi Folk, recently, i have found about 5% of the PCBA failed because of the faulty 10uF Cermanic Chip - Short Circuit. Will this Ceramic Chip cause during the SMT Process (e.g Temperature), Functional Testing or from it Original incoming Capacitor (M
Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process
GPD Global | https://www.gpd-global.com/pdf/doc/Dispense-System-Service-Guide-22290008G.pdf
. No hazardous electrical work - Type 4 tasks - are to be performed on the equipment. WARNING Heated surfaces are found within the system and are indicated by a warning icon
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