Industry Directory | Manufacturer / Manufacturer's Representative
Manufacturer of Polyimide Film and Polyimide Adhesive Tape,Polyimide Sheet,polyimide foam,fpc material,2 layer fccl in china. Yancheng Tiandi Insulation Co.,Ltd Web: https://www.polyimide-pi.com
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Electronics Forum | Sat Oct 19 04:24:56 EDT 2019 | SMTA-Davandran
There is double sided adhesive that able to withstand high temperature during reflow. `keep the adhesive minimum and appropriate location for securing the FPC on pallet during entire SMT process and easier for release of FPC after reflow process. Tak
Industry News | 2013-10-09 10:29:04.0
GPD Global will exhibit in Stand 214 in Hall A4 at the Productronica International Trade Fair. On display will be the versatile Max Series platform for dispensing of SMT glue, solder paste, conductive adhesives, underfill, UV, LED and more, configured with the volumetric PCD4H dispense pump and shown for the first time will be the NCM5000 simplified jetting pump.
Industry News | 2016-02-27 22:07:08.0
GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.
Parts & Supplies | Adhesive Dispensers
Manufacturer of Polyimide Film and Polyimide Tape,Polyimide Sheet in china. 1) H Polyimide Film (6051) 2) FPC Polyimide Film 3) FEP Polyimide Film (FH) 4) Polyimide Adhesive Tape &nb
Parts & Supplies | Tape and Reel
Kapton tape Discriptions: 1. We can according to customer's request and mode making to order. Accept OEM. 2. In the SMT process, the backflow stove measured when furnace temperature glues the thermocouple wire; 3. In the SMT process, uses in gluing
Technical Library | 2013-12-05 17:09:03.0
The functionality of electronic devices continues to increase at an extraordinary rate. Simultaneously consumers are expecting even more and in ever smaller packages. One enabler for shrinking electronics has been the flexible circuit board that allows the circuit board to fit a wide variety of shapes. Flexible printed circuits (FPC) have the capability to be very thin and can have unpackaged components directly attached using surface mount technology (SMT) and flip chip on flex technologies. Bare die can also be thinned and attached very close to the circuit board. However one caveat of high density flexible circuit boards with thin die is that they can be very fragile. The use of back side films and underfill can protect the die making circuits more robust. For underfill to work well it requires good adhesion to the circuit board which can mean that flux residues under the die normally must be removed prior to underfilling.
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Career Center | , Illinois USA | Engineering,Research and Development
DESCRIPTION � Responsible for the development and deployment new printed circuit board assembly processes. � Will assume responsibility for Pb-free/RoHS project management & implementation. � Plans, directs, and coordinates manufacturing processes
Career Center | , New York USA | Engineering,Research and Development
DESCRIPTION � Responsible for the development and deployment new printed circuit board assembly processes. � Will assume responsibility for Pb-free/RoHS project management & implementation. � Plans, directs, and coordinates manufacturing processes
SMTnet Express, December 5, 2013, Subscribers: 26400, Members: Companies: 13507, Users: 35490 Impact of FPC Fabrication Process on SMT Reliability by Susie Krzmarzick, John Dzarnoski, Yangjun Xing; Starkey Hearing Technologies The functionality
| http://etasmt.com/te_news_industry/2021-09-01/24166.chtml
=> PCB A surface screen printing solder paste (SMT adhesive) => patch => drying (curing) => reflow soldering => Cleaning => Plugins => Wave => Cleaning => test = > Rework B, Reflow double-sided mixed technology
