Industry Directory | Consultant / Service Provider
dataCon designs, manufactures and tests high performance, high reliability, backplanes, circuit card assemblies, chasis assemblies for aerospace, defense and medical markets. dataCon is a total solutions manufacturing services company.
Industry Directory | Manufacturer
PDSi provides products and technical services, encompassing the development and production of embedded (built-in) or stand alone computer systems and components, and the testing and repair of computer systems, components and peripherals, to OEMs.
New Equipment | Education/Training
The Electronics Industry’s Source of Data and Insights for Smart Business Decisions. The IPC Technology Market Research Council offers members unique and customized research for the electronics assembly industry. Network with industry leaders at ex
New Equipment | Test Equipment
IN-CIRCUIT TESTER PMP-818S IN-CIRCUIT TESTER PMP-818S What does an in-circuit tester do? In-circuit test performs a “schematic verification” by testing individual components of a printed circuit board (PCBA) one at a time by comparison against a s
Electronics Forum | Fri May 27 04:34:17 EDT 2005 | Rob
Can you not track placement accuracy/feeder performance/print performance just via the AOI in near real time? Once you get a feel for it you can usually tell where the fails stem from, and at most you are only usually around 10 minutes out depending
Electronics Forum | Fri May 27 02:36:27 EDT 2005 | Base
Hi John, What type of machines are you using? (for all you vendor-bashing badmouths out there: this is not an invitation to start advertising you personal favourites!) There may be people out there that have done this trick before on exactly the s
Used SMT Equipment | Pick and Place/Feeders
2018 Mycronic My300 SX-11 Pick and Place Make: Mycronic Model: MY300SX-11 Vintage: 2018 Description: SMT Pick & Place Details: 2 heads (midas & hydra) 11 bay pick and place Electrical 2 Pole Test Electrical Transister Test Shared Data bases Hydra El
Used SMT Equipment | SPI / Solder Paste Inspection
KOH YOUNG KY8030-2 3D SPI The World's Best-selling Full 3D Solder Paste Inspection Best-in-class measurement accuracy and inspection reliability Solves shadow problems by utilizing 2-way projection Provides accurate inspection data with real-time P
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Industry News | 2013-06-07 15:36:04.0
GPD Global has signed a partnership agreement with Aegis Software to distribute CircuitCAM Express data translation software.
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Parts & Supplies | Pick and Place/Feeders
FUJI XPF SINGLE NOZZLE S037 include base FUJI Nozzle 3.7MM ADEPN8065 S037 Y3602 Usage:FUJI pick and place machine Product description: FUJI Nozzle 3.7MM ADEPN8065 S037 Y3602 Fuji nozzle features: 1. CP series nozzles: Original Japan sticker
Parts & Supplies | Assembly Accessories
Detailed Product Description Part Name: CPU Card Part Number: 40044475 Model: ACP-128J Machine: JUKI 2060 2070 FX1R FX3 Machine Condition: Original New Origin: Japan AVAL DATA ACP-128J FX1R PC CPU Board JUKI 2060 2070 FX-3 CPU Card 40044475 D
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2017-12-13 23:58:32.0
In a global market, it is often difficult to determine the best PCB suppliers for your technology needs, while also a chieving the lowest costs for your products. Considering each PCB supplier has their own niche in t erms of equipment, process, and performance, uniform test data from the IPC -9151D Process Capability, Quality, and Relative Reliability (PCQR 2 ) Benchmark Test Standard can help find the right source for the board based on its specific technology requirements. By using a data-based approach to vendor selection, this can remove the subjective nature of sourcing, reduce the need for PCB process experts to map suppliers into technologies, and eliminate irrational sourcing decisions.
The Electronics Industry’s Source of Data and Insights for Smart Business Decisions. The IPC Technology Market Research Council offers members unique and customized research for the electronics assembly industry. Network with industry leaders at ex
The CameraLink industrial digital cameras offer high performance in a very small footprint. The advanced 25M color CMOS sensor provides the absolute best image quality at an incredible frame rate of 30 fps! The camera Link Interface ensures High spee
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Wed Jul 19 00:00:00 EDT 2023 - Wed Jul 19 00:00:00 EDT 2023 | ,
SMTA Webinar: Secure, Intelligent, Detailed Design Data Exchange Between Design & Manufacturing
Events Calendar | Tue Jul 16 00:00:00 EDT 2024 - Tue Jul 16 00:00:00 EDT 2024 | ,
Arizona/Sonora & San Diego Joint Chapter Webinar: The Data Revolution Within SMT Manufacturing
Career Center | Regent, North Dakota USA | Management
SUMMARY OF RESPONSIBILITIES: The purpose of this position is to provide guidance and support to production operations in the area of the Manufacturing Supervisors responsibility and to provide a work environment where coworkers have the tools, train
Career Center | Killdeer, North Dakota USA | Quality Control
Summary of Responsibilities: The purpose of this position is to provide guidance and support to the Quality Department in the area of the Site Quality Managers responsibility and to provide a work environment where coworkers have the tools, trainin
Career Center | , | Engineering,Maintenance,Production
Production Planning ~ Supply Chain Management ~ Productivity Management ~ Sub Contracting Management ~ Process Quality Management ~ Process innovation & Lean Mfg ~ Cost efficiency Management ~ Manpower Management ~Multi Skilling & Training, Six Sigma
Career Center | BANGALORE, Karnataka India | Quality Control
New Model Evaluation • Testing & Evaluation of New TV models as per the relavant standards & release the defect free product for Mass Production • Measurement of audio parameters like Max out put, distotion, S/N ratio, hum, buzz etc • To conduct aud
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