Industry Directory | Manufacturer
Mica-AVA (Far East) Industrial Ltd (MAF) cooperate with Hitachi Chemicals manufactures high reliability, high-quality and quick-turn laminate FR4 products (Normal, High Tg and Halogen free)
Industry Directory | Manufacturer
1 to 30-layer FR-4 PCBs with HDI, Aluminum based PCBs, Copper based PCBs & Iron based PCBs; - Prototype and mass production of High-Mix, Medium or Low-Volume orders. - Quality Guaranteed.
New Equipment | Assembly Services
PNC Inc. has been manufacturing hi-reliability printed circuit boards since 1968. All Military Spec PC boards are manufactured in the security of our Nutley NJ, USA facility. PNC is certified by the Department of Defense to Military Performance Speci
The MSL baking process at OX3 Corporation, (�MSL� stands for Moisture Sensitivity Level), is in accordance with IPC and JEDEC Standard "J-STD-033A," the joint industry standard for semiconductor handling, packing, shipping and the use of moisture/ref
Electronics Forum | Mon Jun 28 09:15:21 EDT 2004 | jdumont
Morning all, we have been seeing some problems with the edges of some of our BGA's curling away from the PCB after reflow. Is this possibly a moisture problem? If so what would be a good time/temp to bake them at to rectify the problem? Thanks in
Electronics Forum | Fri Feb 19 06:45:29 EST 1999 | Charles Stringer
Does anybody have any reliable alternatives to device bake out for plastic bodied components. We do not use a whole package at time and therefore have to oven bake the balance before we can use them. I have come accross dry nitrogen storage chambers
Used SMT Equipment | SMT Equipment
Baking SMT on a cheap kitchen toaster oven is not difficult. You just need some patience and exploration good will. In this page you will read the manual procedure to bake SMD boards into a regular kitchen toaster oven appliance. Follows information
Used SMT Equipment | Soldering - Reflow
Despatch TDF2-52-1E Bake Oven Brand: DespatchModel: TFD2-52-1ESerial number: 194309Max Operating Temperature: 343C (650F)F.A. DUCT 7.00" DIAEXH. DUCT: 2.50" x 13.5"F.A. Damper Blade Cut to: 1.38" DIA Holes 2XEXH. Damper Blade Cut to: 11.25LGMinimum p
Industry News | 2003-06-05 08:11:23.0
Kerry co-solvent system pays for itself in 13 months
Industry News | 2018-10-18 10:23:07.0
Typical RoHS Issues in PCB Assembly
Parts & Supplies | Board Cleaners
SMT multifunctional steel net switch frame use for all kind Screen Printing Equipments It’s use for SMT Screen printer machine exchange the steel net, easy exchange , save time and money. Use for size 650*550mm, 580*580mm, 550*650mm,520*420mm,
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Parts & Supplies | Pick and Place/Feeders
DEK - SPARE PARTS Horizon 8 power supply unit 200885 160555 SMPSU, 650W WIDE RANGE I-P (FASTON TERMS) (TXT) 181229 BOM^LOOM & MOTOR^CONVEYOR^ (TXT) 157731 REAR RAIL MOTOR & LOOM ASSEMBLY 156918 RAIL MOTOR & LOOM ASSEMBLY 155692 MOVING RAIL
Technical Library | 2018-09-21 10:12:53.0
Moisture accumulates during storage and industry practice recommends specific levels of baking to avoid delamination. This paper will discuss the use of capacitance measurements to follow the absorption and desorption behaviour of moisture. The PCB design used in this work, focused on the issue of baking out moisture trapped between copper planes. The PCB was designed with different densities of plated through holes and drilled holes in external copper planes, with capacitance sensors located on the inner layers. For trapped volumes between copper planes, the distance between holes proved to be critical in affecting the desorption rate. For fully saturated PCBs, the desorption time at elevated temperatures was observed to be in the order of hundreds of hours. Finite difference diffusion modelling was carried out for moisture desorption behaviour for plated through holes and drilled holes in copper planes. A meshed copper plane was also modelled evaluating its effectiveness for assisting moisture removal and decreasing bake times. Results also showed, that in certain circumstances, regions of the PCB under copper planes initially increase in moisture during baking.
Technical Library | 2022-09-12 14:07:47.0
Unique component handling issues can arise when an assembly factory uses highly-moisture sensitive surface mount devices (SMDs). This work describes how the distribution of moisture within the molded plastic body of a SMD is an important variable for survivability. JEDEC/IPC [1] moisture level rated packages classified as Levels 4-5a are shown to require additional handling constraints beyond the typical out-of-bag exposure time tracking. Nitrogen or desiccated cabinet containment is shown as a safe and effective means for long-term storage provided the effects of prior out-of-bag exposure conditions are taken into account. Moisture diffusion analyses coupled with experimental verification studies show that time in storage is as important a variable as floor-life exposure for highly-moisture sensitive devices. Improvements in floor-life survivability can be obtained by a handling procedure that includes cyclic storage in low humidity containment. SMDs that have exceeded their floor-life limits are analyzed for proper baking schedules. Optimized baking schedules can be adopted depending on a knowledge of the exposure conditions and the moisture sensitivity level of the device.
Full Automatic V-cut PCB Depaneler Introduction: This equipment can further improve the quality of depaneling. It can realize V-groove XY two-way automatic cutting, cutting aluminum & FR4 boards without burr, can connect the assembly line to realize
http://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2015/0610/157.html http://www.pcb-separator.com/ PCB Separator supplier/PCB Separator factory/pcb cutting machine manufacturer/pcb depaneling tool/V-cut pcb separator/LED strip cutter
Career Center | Theni, Tamilnadu India | Engineering
NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu
| https://www.eptac.com/faqs/ask-helena-leo/ask/ceramic-ccas-and-aqueous-wash-and-bake-out-prior-to-parylene-coating
. As for drying the material, this would depend upon the length of time that is taken from the bake cycle to the conformal coating cycle and what the relative humidity is in the particular area of the facility
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