Industry Directory | Manufacturer
Professional, Reliable,High Quality,Low Cost, Rapid Delivery PCB manufacturer
Industry Directory | Manufacturer / Other
Established in 2002, We specialize in the production of composite materials, engineering plastic, PCB solder pallet material, wave&reflow solder pallet. composite stone (Durostone), Bakelite sheet, glass fiber POM sheet & Acrylic.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
New Equipment | Assembly Services
1,012 (normal) Electric strength: >1.3kV/mm Thermal stress: 288°C, 20 seconds Test voltage: 50 to 300V
Electronics Forum | Wed Oct 18 16:41:35 EDT 2000 | Dave F
It's unrealistic to think that two materials with the following disperant properties would have the same reflow profile. From http://www.norplex.com/Carrier.htm Physical Properties / NEMA FR-4 / NEMA CEM-1 Glass transition temperature �C / 130 / 10
Electronics Forum | Fri Jun 04 01:13:31 EDT 2010 | boardhouse
Hi fotis, Big difference between Cem3 & FR4 is that FR4 the glass is woven and Cem3 is sheet glass non-woven. for Multi layer product, i would not consider Cem3 due to increase chance of de-lam due to lack of weave for strength. Cem1 and Cem3 are
Industry News | 2019-11-05 22:10:56.0
Many customers and electronic designers were asking questions about the aluminum-based board, today our chief technical official Luca Zhang shared the knowledge and experience to you.
Industry News | 2011-01-18 13:46:21.0
Time and again, a major challenge lies in attaching integrated circuits (ICs) to highly integrated circuit board substrates in a space-saving manner. Würth Elektronik took this challenge on and found an ideal solution with the ESC (encapsulated solder connection) process. The chips are soldered and at the same time glued 'face-down" in their exact position.
Parts & Supplies | Pick and Place/Feeders
101004 TRANSISTOR BC108 NPN 101020 POWER SUPPLY – UPRATED CURRENT 101047 SQUEEGEE MATERIAL 9.5 X 9.5 85-90 101081 CONNECTOR CIRCULAR 14WAY 97-3102A 101142 FRONT SQUEEGEE CARRIAGE 101143 OUTER MTG SQUEEGEE BLOCK 101145 COVER (TXT) 101146
Parts & Supplies | Pick and Place/Feeders
101004 TRANSISTOR BC108 NPN 101020 POWER SUPPLY – UPRATED CURRENT 101047 SQUEEGEE MATERIAL 9.5 X 9.5 85-90 101081 CONNECTOR CIRCULAR 14WAY 97-3102A 101142 FRONT SQUEEGEE CARRIAGE 101143 OUTER MTG SQUEEGEE BLOCK 101145 COVER (TXT) 101146
Technical Library | 2016-01-12 11:03:35.0
With the pitch size of interconnect getting finer and finer, the bonding strength between flexible and rigid (e.g. PCB, ceramic) substrates becomes a serious issue because it is not strong enough to meet the customer’s requirement. Capillary underfill has been used to enhance the bonding strength between flexible and rigid substrates, but the enhancement is very limited, particularly for high temperature application. The bonding strength of underfilled flexible/rigid interconnect is dramatically decreased after being used at 180◦C, and the interconnects are weakened by the internal stress caused by the expansion of underfill at high temperatures. In order to resolve reliability issues of the interconnect between flexible/rigid substrates, solder joint encapsulant was implemented into the thermal compression bonding process, which was used to manufacture the interconnect between flexible/rigid substrates. Compared to the traditional process, the strength of the interconnect was doubled and the reliability was significantly improved in high temperature application.
Technical Library | 2022-01-05 23:14:20.0
The process of copper recovery from waste printed circuit board has generated large amounts of non-metallic fraction (NMF) residue. In this research, the residue was recycled as a substitute for fine aggregates at 0%, 5%, 10%, 15%, and 20% to produce interlocking concrete blocks. Properties of the interlocking concrete blocks produced in this study, such as density, water absorption, compressive strength, were firstly examined and the selected mixes were further evaluated for the heavy metal leachability.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
http://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2015/0607/132.html PCB cutting machine/guillotine separator/PCB depaneling machine/PCB panel separator ASCEN specializing the SMT assmebly line equipment manufacture the more detail please ch
Career Center | chennai, India | Production
i also working in smt operator an 6 mounth.so,i am searching better for my working company.my smt knowledge is operating on printer,pick&place and also reflow and wave soldring.i am operate at full function an the smt machine and i know the all smt c
ORION Industries | http://orionindustries.com/pdfs/lexan9600.pdf
% 85 MECHANICAL Tensile Strength ASTM D638 psi @ Yield 9,500 Ultimate 9,000 Elongation ASTM D638 % 95 Tensile Modulus ASTM D638 psi 235,000 Flexural Strength ASTM D790 psi 13,500 Flexural Modulus ASTM D790 psi 370,000 Compressive Strength ASTM D695 psi 12,500 Dynatup Impact Strength, 1/2" dia. dart, (gauge dependant)***, @ 73
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/information/xaloy-wear-technology
. Filled resins are chosen for their superior properties, which include increased tensile and compressive strength, chemical resistance, dielectric, and thermal dimensional stability
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