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ChangDa was founded in 2001, it is a comprehensive company that engaged in R&D, production and marketing of thermal insulation and ESD reinforced plastics.
Description This product is a kind of laminated board formed through heat pressing after the electric industry fiolax cloth dips into epoxy resin. It is suitable as the mechanical, electric and electronic insulation structural components which are us
Benchtop semi-automatic (16”x 16” print area) for lab/prototype or general production Pneumatic shuttle plate on v-wheels for easy substrate loading/unloading Pneumatic pop-up cylinders with adjustable separation control. Great for low vi
Electronics Forum | Sat Sep 25 07:07:02 EDT 1999 | Brian
| I need a memory jog. What is the term for the growth of conductive contamination after a board is in storage or field? | There are several different mechanisms which can cause this. In reality, ionic contamination is the root cause for many of the
Electronics Forum | Fri Jan 21 14:51:08 EST 2000 | Dave F
Mike: I�d hate to see you making design decisions, based solely on the discussion here, but that this would be an impetus to consult IPC-D-279, "Design Guidelines ... " and take a course on designing reliable boards. Werner Engelmaier (Engelmaier
Industry News | 2019-11-05 22:10:56.0
Many customers and electronic designers were asking questions about the aluminum-based board, today our chief technical official Luca Zhang shared the knowledge and experience to you.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Technical Library | 2013-10-31 17:36:41.0
Multilayer printed circuit boards (PCBs) that utilize high performance materials are inherently far more challenging for a fabricator to build, due to significant material property differences over standard epoxy glass FR4. These unique material characteristics often require higher processing temperatures, special surface treatments (to aid in hole and surface plating), they possess different expansion properties, making layer-to-layer registration more difficult to control, and require many other unique considerations.
