Industry Directory | Consultant / Service Provider
We are your obsolete industrial product specialists. Our inventory includes VME, cPCI, ATCA, SBCs and much more industrial electronics
Industry Directory | Manufacturer
Flason is high-tech enterprise focusing on SMT research and development,building new advanced solutions in SMT Assembly machines, like reflow oven, wave soldering machine, pick and place machine, AOI,SPI,PCB conveyor etc.
ASCEN-620 Depaneling machine for separating aluminium panel-FR4/CEM-1 The more detail and video please check the link: www.pcb-separator.com For more than 10 years our PCB depaneling machines are developed and improved continuously, in orde
ASCEN-620 Depaneling machine for separating aluminium panel-FR4/CEM-1 Our product can cut the board with the led chip no damage and no bend. After extensive tests of the separation process a lot of automobile suppliers use exclusively the depan
Electronics Forum | Fri Jan 04 09:44:59 EST 2008 | philkaz
Hello, I am Philip Kazmierowicz and I work with KIC, a Thermal Profiling company. We have done many lifetime experiments on Printed Circuit Boards over the years. The key thing to understand is that if the primary material of the board in FR4 fiber
Electronics Forum | Mon Dec 24 19:12:06 EST 2007 | adamben10
I'm shadowing an old posting posted by Odor back in March 2002. Any Expert out there, if you have good answer to the below questions, please dive in...Thanks in advance. 1) Does anybody have done the profiling board life time experiment? 2) The prof
Used SMT Equipment | SPI / Solder Paste Inspection
PARMI/SPI SPIHS60 MACHINE PARMI HS60 (supreme) solder paste thickness tester SPI The SPI HS60 (supreme) series is the next generation fastest online solder paste inspection system on the market. The measurement speed at a resolution of 13x13um is
Used SMT Equipment | In-Circuit Testers
FSM-60S Fusion Splicer Kit (with cleaver) - The FSM60S fusion splicer sets the standard for core alignment fusion splicing by incorporating a user-friendly interface with enhanced features to provide the most rugged and reliable fusion splicer in the
Industry News | 2003-06-05 08:11:23.0
Kerry co-solvent system pays for itself in 13 months
Industry News | 2003-04-15 08:39:15.0
Granted supplier qualification by the United States Department of Defense's Defense Supply Center Columbus (DSCC)
Technical Library | 2022-10-11 20:29:31.0
Electronic assemblies deployed in harsh environments may be subjected to multiple thermal environments during the use-life of the equipment. Often the equipment may not have any macro-indicators of damage such as cracks or delamination. Quantiication of thermal environments during use-life is often not feasible because of the data-capture and storage requirements, and the overhead on core-system functionality. There is need for tools and techniques to quantify damage in deployed systems in absence of macro-indicators of damage without knowledge of prior stress history. The presented PHM framework is targeted towards high reliability applications such as avionic and space systems. In this paper, Sn3.0Ag0.5Cu alloy packages have been subjected to multiple thermal cycling environments including -55 to 125C and 0 to 100C. Assemblies investigated include area-array packages soldered on FR4 printed circuit cards. The methodology involves the use of condition monitoring devices, for gathering data on damage pre-cursors at periodic intervals. Damage-state interrogation technique has been developed based on the Levenberg-Marquardt Algorithm in conjunction with the microstructural damage evolution proxies. The presented technique is applicable to electronic assemblies which have been deployed on one thermal environment, then withdrawn from service and targeted for redeployment in a different thermal environment. Test cases have been presented to demonstrate the viability of the technique for assessment of prior damage, operational readiness and residual life for assemblies exposed to multiple thermo-mechanical environments. Prognosticated prior damage and the residual life show good correlation with experimental data, demonstrating the validity of the presented technique for multiple thermo-mechanical environments.
Technical Library | 2021-07-20 20:02:29.0
During the manufacturing of printed circuit boards (PCBs) for a Flight Project, it was found that a European manufacturer was building its boards to a European standard that had no requirement for copper wrap on the vias. The amount of copper wrap that was measured on coupons from the panel containing the boards of interest was less than the amount specified in IPC-6012 Rev B, Class 3. To help determine the reliability and usability of the boards, three sets of tests and a simulation were run. The test results, along with results of simulation and destructive physical analysis, are presented in this paper. The first experiment involved subjecting coupons from the panels supplied by the European manufacturer to thermal cycling. After 17 000 cycles, the test was stopped with no failures. A second set of accelerated tests involved comparing the thermal fatigue life of test samples made from FR4 and polyimide with varying amounts of copper wrap. Again, the testing did not reveal any failures. The third test involved using interconnect stress test coupons with through-hole vias and blind vias that were subjected to elevated temperatures to accelerate fatigue failures. While there were failures, as expected, the failures were at barrel cracks. In addition to the experiments, this paper also discusses the results of finite-element analysis using simulation software that was used to model plated-through holes under thermal stress using a steady-state analysis, also showing the main failure mode was barrel cracking. The tests show that although copper wrap was sought as a better alternative to butt joints between barrel plating and copper foil layers, manufacturability remains challenging and attempts to meet the requirements often result in features that reduce the reliability of the boards. Experimental and simulation work discussed in this paper indicate that the standard requirements for copper wrap are not contributing to the overall board reliability, although it should be added that a design with a butt joint is going to be a higher risk than a reduced copper wrap design. The study further shows that procurement requirements for wrap plating thickness from Class 3 to Class 2 would pose little risk to reliability (minimum 5 μm/0.197 mil for all via types).Experimental results corroborated by modeling indicate that the stress maxima are internal to the barrels rather than at the wrap location. In fact, the existence of Cu wrap was determined to have no appreciable effect on reliability.
http://www.pcb-separator.com/ Nutzentrennmaschine/Nutzentrenner/PCB depaneling machine ASCEN-620 NSL zum Trennen von Aluminium Leiterplatten/FR4
http://www.pcb-separator.com/ Nutzentrennmaschine/Nutzentrenner/PCB depaneling machine ASCEN-620 NSL zum Trennen von Aluminium Leiterplatten/FR4
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Tue Jun 23 00:00:00 EDT 2020 - Thu Jun 25 00:00:00 EDT 2020 | College Park, Maryland USA
Symposium on Counterfeit Parts and Materials
Events Calendar | Tue Mar 05 00:00:00 EST 2024 - Wed Mar 06 00:00:00 EST 2024 | Ansty Park, Coventry United Kingdom
Counterfeit Electronics & Materials Symposium - UK
Career Center | Shenzhen, China | Purchasing
Job requirements & responsibilities: 1. Skilled in English reading and writing. 2. Familiar with BOM and list analysis. 3. Familiar with electronic components, brands, and cycle life. 4. Skilled use of computer office software. 5. Good abil
Career Center | Newark, New Jersey | Engineering,Management,Research and Development
We're actively searching for Wireless Product Managers and a Director of Product Management to help lead the push into next generation rugged handheld devices. These opportunities exist within a well funded, profitable, and high growth sector and ha
Career Center | chennai, India | Engineering,Maintenance
Nokia India Pvt LTD. Sriperumpudur – Board Assembler Maintenance Technician from Sep 2009 to till now. Machines Handled Pick & Place : FUJI NXT Machines FUJI NXT - M3 II ,M3S. Reflow oven: Hot flow 3/20, 2/14. Stencil Pr
Career Center | Sugar land, Texas USA | Engineering,Maintenance,Management,Production,Sales/Marketing,Technical Support
Production Management, SMT, Manufacturing Engineering, Programming, CircuitCam, Inventory Control, AOI, Fuji AIM/ NXT, Assembleon, Universal, Quad, Mydata, Heller, DEK, Mirtec, Aqueous Tech, MPM, Resys, Vapor Phase, Juki, Selective Soldering, HMP, El
Surface Mount Technology Association (SMTA) | https://www.smta.org/counterfeit/
& Conference Center The symposium is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD, USA
Imagineering, Inc. | https://www.pcbnet.com/blog/dissolving-barriers-how-water-soluble-printed-circuit-boards-could-solve-e-waste/
. Multiple layers of substrate material, traditionally fiberglass-reinforced epoxy resin (FR4), are bonded together with copper foil in between
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