Industry Directory | Manufacturer / Other
ISO certified global manufacturer and supplier of light-curable adhesives, coatings, oligomers, dispense systems, light-curing equipment, and technical consulting for the industrial, medical, and electronics industries.
Axial Glass NTC Thermistor Temperature Sensor is transition metal oxide material made semiconductor ceramic NTC Thermistor chip hermetically sealed in DO35 glass shell, with axial tinned Dumet wire, for temperature sensing measurement detection, indi
New Equipment | Test Equipment
ThorLabs Inc. ASE-FL7200 ASE FL 7200 White Light Test Source The ThorLabs ASE-FL7200 is a high-brightness white light test source. This high-brightness test source is designed to lproduce amplified spontaneous emission (ASE) ranging from 1440nm to
Electronics Forum | Thu Jan 20 16:06:38 EST 2000 | Mike Naddra
Regarding glass transition , does anyone have expierance glass wiht transition temperature specification , such as what are the detrimental effects of exceeding the Tg , how long over the glass transition temperature ,if any , is acceptable. Tg of di
Electronics Forum | Fri Jan 21 14:51:08 EST 2000 | Dave F
Mike: I�d hate to see you making design decisions, based solely on the discussion here, but that this would be an impetus to consult IPC-D-279, "Design Guidelines ... " and take a course on designing reliable boards. Werner Engelmaier (Engelmaier
Industry News | 2020-01-07 11:09:15.0
IPC-8921 establishes classifications and designations for woven and knitted e-textiles integrated with e-fibers, e-yarns and e-wires. It also standardizes key characteristics and durability testing for these materials as well as the industry test methods to be used to test against those characteristics.
Technical Library | 1999-07-21 08:49:49.0
As the role of direct-chip-attachment increases in the electronics industry, the reliability and performance of COB packaging materials becomes an increasing concern. Although many factors influence component reliability, the biggest determinants of performance are often the glass transition temperature (Tg) and the coefficient of thermal expansion (CTE) of the encapsulant or underfill. This paper discusses exactly what these properties are, how they are measured, and why they are important to device-reliability.
Technical Library | 2014-06-26 16:43:12.0
Edgebond adhesives have been widely used by the industry for improving the shock performance of area array packages. Most of the studies focus on the impact of material properties, such as coefficient of thermal expansion (CTE) and glass transition temperature (Tg), on reliability at room temperature. However, the operating temperature of a component on the printed circuit board bonded with edgebond adhesive can be close to or exceed Tg of the adhesive, where the material properties may be very different than at room temperature.
The LPKF MicroLine 1000 S is perfect for cutting break-out tabs and complex contours at highest accuracy. The benefits include shorter time to market and much higher quality cuts than conventional methods. The machine's UV laser is an optimal tool fo
The industrial chain of laser processing has formed a complete ecological chain of laser processing from enterprises producing core lasers upstream to enterprises producing various kinds of laser processing equipment and then to enterprises providing
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/RSS_determine-hole-size-for-plastic-peg-alignment-pins_topic720.xml
(Glass Transition Temperature)... Author: Tom HSubject: 720Posted: 29 Dec 2012 at 2:51pmThe Tg (Glass Transition Temperature) relates to the PCB expansion in the "Y" axis or board thickness
Imagineering, Inc. | https://www.pcbnet.com/blog/selecting-pcb-materials-for-fabrication/
. In high-heat applications, it is essential that a board continues to work without losing functionality. Glass transition temperature (Tg
