Industry Directory | Equipment Dealer / Broker / Auctions
WINTECH provides new/used/pre-owned SMT, AI & PCB Assembly (PCBA) equipment of various brands. Also supply service, modification & original or local-made spare parts. We are also an appointed agent for well-known brands.
Industry Directory | Manufacturer
Autorised distributors of Fuji Machine Mfg & JBC Soldering Equipment
New from Fuji, the AIM board assembler is designed specifically for the High Mix/Low Volume and prototyping environments. The AIM provides 180 feeder inputs, a placement range from 0201 components thru 74mm square and a rated speed of 20,300 cph.
SMTBOX supports various kinds of original SMT spares for FUJI electronic assembly equipments model CP3 CP4 CP6 CP7 CP8 IP1 IP2 IP3 QP1 QP2 QP3 NP153 XP142 XP242 NXT NXTII AIM such like feeder,nozzle and other replacement parts.
Electronics Forum | Wed Oct 20 11:39:01 EDT 2010 | mikesewell
On our Fuji NXT and AIM machines I never program local fids...we place down to 16 mil fine pitch and BGA, uBGA, multirow QFNs with no placement issues. Most boards are panelized in an array and we have corner fids added to the rails. Regards, Mi
Electronics Forum | Sun Jun 19 20:20:50 EDT 2005 | fastek
I might be over simplifying this but what I understand is the AIM is a more economical version of the NXT and that AIM will replace the XP platform.
Used SMT Equipment | Pick and Place/Feeders
we need to buy FUJI chip mounter machine FUJI AIM,AIMEX，AIMEX-II，AIMEX-III steven wong Email: 13560819457@139.com
Used SMT Equipment | Chipshooters / Chip Mounters
we need to buy FUJI chip mounter machine FUJI AIM,AIMEX，AIMEX-II，AIMEX-III steven wong Email: 13560819457@139.com
Industry News | 2003-02-27 08:22:44.0
Circatex is to open its first satellite office in mainland Europe in France.
Industry News | 2024-03-18 11:59:32.0
The SMTA is excited to announce a Workforce Development Breakfast Panel, "Building Tomorrow's Expertise," taking place on March 26, 2024 in Peoria, Arizona, USA. The panel will be held at the Peoria Sports Complex, in conjunction with the SMTA Ultra High Density Interconnect Symposium.
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Parts & Supplies | Pick and Place/Feeders
SME8MM electric feeder power line outer triangle panel J7065981A Other Samsung feeder parts in stock: HP14-000163 J70550548A J70550549A J91661028A J81001072A J91741331A AM03-000755A J91661043A J91661044A J91851072A J91851093A J91661042A
Parts & Supplies | Assembly Accessories
Fuji 2EGTHA000202 NXT H24 IPS light source light panel LED light panel
Technical Library | 2018-05-30 15:31:21.0
The aim of this research is to examine the relationship between green logistics operations and energy demand, economic growth and environmental sustainability need to make factors for relationship clearer in a panel data of 43 different countries around the globe. The study employed panel Generalized Method of Moments (GMM) estimates for robust inferences. The results have revealed that logistics operations consume energy and fossil fuel, while the amount of fossil fuel and non-green energy sources create significant harmful effect on the environmental sustainability and also have negative effect on economic growth. In addition, poor transport-related infrastructure and logistics service are a major contributor of CO2 and total greenhouse gas emissions. However, carbon emission damages fauna and flora, and reduces economic growth. The findings suggest that renewable energy sources and green practices can mitigate harmful effect of logistics operations on environmental sustainability and spur economic activities with greatly export opportunities in a region.
Technical Library | 2020-09-02 22:02:13.0
With the adoption of Wafer Level Packages (WLP) in the latest generation mobile handsets, the Printed Circuit Board (PCB) industry has also seen the initial steps of High Density Interconnect (HDI) products migrating away from the current subtractive processes towards a more technically adept technique, based on an advanced modified Semi Additive Process (amSAP). This pattern plate process enables line and space features in the region of 20um to be produced, in combination with fully filled, laser formed microvias. However, in order to achieve these process demands, a step change in the performance of the chemical processes used for metallization of the microvia is essential. In the electroless Copper process, the critical activator step often risks cross contamination by the preceding chemistries. Such events can lead to uncontrolled buildup of Palladium rich residues on the panel surface, which can subsequently inhibit etching and lead to short circuits between the final traces. In addition, with more demands being placed on the microvia, the need for a high uniformity Copper layer has become paramount, unfortunately, as microvia shape is often far from ideal, the deposition or "throw" characteristics of the Copper bath itself are also of critical importance. This "high throwing power" is influential elsewhere in the amSAP technique, as it leads to a thinner surface Copper layer, which aids the etching process and enables the ultra-fine features being demanded by today's high end PCB applications. This paper discusses the performance of an electroless Copper plating process that has been developed to satisfy the needs of challenging amSAP applications. Through the use of a radical predip chemistry, the formation, build up and deposition of uncontrolled Pd residues arising from activator contamination has been virtually eradicated. With the adoption of a high throwing power Copper bath, sub 30um features are enabled and microvia coverage is shown to be greatly improved, even in complex via shapes which would otherwise suffer from uneven coverage and risk premature failure in service. Through a mixture of development and production data, this paper aims to highlight the benefits and robust performance of the new electroless Copper process for amSAP applications
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
Career Center | , Portugal | Engineering,Maintenance,Production,Quality Control,Technical Support
SMT Process engineer Quality Efficiency Continuous improvement 11 years of experience in high volume production in a Japanese corporation Expertise in: Solder paste printing (DEK, Panasonic) Adhesive dispensing (FUJI, Panasonic) Components Pick and p
Career Center | Melbourne, Florida USA | Engineering
I have over 24 years experience in the PCB manufacturing arena. My career knowledge is in most SMT manufacturing equipment. Creating and troubleshooting manufacturing assembly processes and creating detailed work instructions using Microsoft Power
A Practical Guide to Achieving Lead-Free Electronics Assembly A Practical Guide to Achieving Lead-Free Electronics Assembly AIM Credit/Source: Karl Seelig, David Suraski To successfully achieve lead-free electronics assembly, each participant
SMTnet Express, April 10, 2014, Subscribers: 22635, Members: Companies: 13857, Users: 36009 Solar Panel Design Decision and General Information Sheet Alexander L Carrere; iSAT Group This paper is meant to be a guide and a reference to new and old
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/aj533-aim-monitor-220159?page=12&category=1145
FUJI AIM monitor AJ533** | QYSMT × Home about Us FAQ SMT spare parts SMT surplus equipment SMT peripheral equipments News Contact US 0 0 Sign in contact us Products Others SMT parts AIM monitor Public Pricelist Public Pricelist AIM monitor .AJ533
| https://pcbasupplies.com/smt-equipment-fuji-nxt-aim-series/
» SMT Standard Nozzles » Fuji » NXT|AIM Series NXT|AIM Series AIM H08, H12, & V12 Nozzles AIM H08M Nozzles AIM Other Consumables NXT
