Electronics Forum | Mon May 10 19:36:08 EDT 2004 | gabriele
Many Tnks Dave, always helpful is your support. I am not familiar how to access EMPF, I have tried already last wk but I was able to read only the abstract of RR0013. Is the access for free or it necessary to be a registered SMTA member ? Regards G
Electronics Forum | Tue May 18 17:07:18 EDT 2004 | gabriele
Wave Solder temperature should not cause problem to MSDs. Just in case on PBA there are very critical MSLs (ie. 5 or 5a, 6 (?!?) try to detect what is the max temperature on such MSD bodies and how long they stay under such temperature. But it schoul
Industry News | 2012-12-17 19:16:10.0
IPC — Association Connecting Electronics Industries® announces registration is now open for the IPC Conference on Solderability and Reliability for Electronics Assemblies.
Industry News | 2014-04-24 16:31:54.0
It was all business at IPC APEX EXPO® last month as 8,068 electronics manufacturing professionals from 47 countries converged at the Mandalay Bay Convention Center in Las Vegas.
Technical Library | 2018-03-07 22:41:05.0
This study investigates the scooping effect during solder paste printing as a function of aperture width, aperture length and squeegee pressure. The percent of the theoretical volume deposited depends on the PWB topography. A typical bimodal percent volume distribution is attributed to poor release apertures and large apertures, where scooping takes place, yielding percent volumes 100%. This printing experiment is done with a concomitant validation of the printing process using standard 3D Solder Paste Inspection (SPI) equipment.
SMTnet Express, March 8, 2018, Subscribers: 31,288, Companies: 10,911, Users: 24,465 Optimization of Stencil Apertures to Compensate for Scooping During Printing Gabriel Briceno, Ph. D., Miguel Sepulveda; Qual-Pro Corporation This study
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