Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Electronics Forum | Mon Jul 31 21:33:58 EDT 2006 | seth
What is the distance from the reader to the segment, and can you use a filler gauge to set the gap or is there a special tool needed?
Electronics Forum | Sat Nov 24 22:15:16 EST 2001 | Glenn Robertson
Tony, I'm not sure if even baking will stop the voids if you have gaps in the plating. It probably doesn't take much moisture or even trapped air. I'm not speaking from a lot of direct experience here, so please run the tests and let us know wh
Industry News | 2022-05-05 17:28:46.0
Includes new, easy-to-operate pail pump with unique pail change and loading method, which also reduces material waste
Industry News | 2013-05-01 12:45:51.0
Held at the Rijckholt Castle and Nordson ASYMTEK European Headquarters in Maastricht
Parts & Supplies | Pick and Place/Feeders
GapFiller / GTQ2100 d:4,6mm 7x16mm 2pcs
Technical Library | 2018-06-18 13:43:56.0
Thermal influences can significantly compromise the service life, capacity and especially the operational safety of HV batteries. In order to prevent damage due to excessive temperatures, large quantities of heat-conducting potting media are used here. Scheugenpflug has developed a new system solution for fast and reliable application of these materials.
Rugged Material Feeding Unit for Highly Abrasive Dispensing Media With High Viscosity. Loading of Material From 20-Litre Drums With the Patented Scheugenpflug Barrel Follower Plate. The barrel (hobbock, pail) is positioned on the ergonomic hobbock d
Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections. Influence of Nanoparticles, Low Melting
SMTnet Express, November 7, 2019, Subscribers: 32,325, Companies: 10,919, Users: 25,284 Origin and Quantification of Increased Core Loss in MnZn Ferrite Plates of a Multi-Gap Inductor Credits: Power Electronic Systems Laboratory (PES) Inductors
Imagineering, Inc. | https://www.pcbnet.com/blog/high-temperature-pcb-considerations-for-high-heat-applications/
. However, some debate exists as to whether heat spreading in a thicker copper layout lowers the total thermal resistance. The use of thermal adhesives can eliminate the need for mechanical fasteners like clips or screws, and can help reduce thermally conductive silicon insulators or gap fillers that isolate a device from a heat sink
GPD Global | https://www.gpd-global.com/co_website/fluid-dispense-tim-application.php
. Alternatively, when a larger gap or holding power is required, a thermal adhesive is the recommended solution. Metal oxides are key to heat transfer but are highly abrasive
