Industry Directory | Manufacturer
XPCB is a PCB manufacturer with superior expertise in multilayer rigid-flex PCB and flex PCB, supporting special technology including VIPPO, stacked vias, buried vias, blind vias, unsymmetrical structure, and air gap structure.
Full-featured and compact benchtop dispense system robot offering accurate and repeatable dispense results! A benchtop dispense system does not mean "no features". The Catalina benchtop dispense system is a full-featured platform with these standard
We are well versed in the following thermal application materials: Sil-Pad thermally conductive insulators Gap-Pad thermally conductive gap filling material Q-Pad thermal grease replacement film Bond-Ply thermally conductive adh
Electronics Forum | Thu Oct 20 20:44:15 EDT 2011 | davef
Design based on: * IPC-SM-782A: Gap 0.0157", Pad 0.0354"X0.0276" [along gap] * IPC-SM-782A Mod used on 32411A1 & Volvo Smart Switch: Gap 0.0157", Pad 0.020"X0.020" [along gap] * IPC-7351: Gap 0.008", Pad 0.0256"X0.0256" [along gap]
Electronics Forum | Tue Apr 04 02:51:41 EDT 2006 | arnold
Hi everyone, can you tel me on how to compute (mathematically)the inductance of transformer having having gap core. what i know is inductance for ungapped core L = Al value of core x square the no. of turns how about for gapped core
Used SMT Equipment | Screen Printers
MPM Momentum+ Printer Substrate treatment Maximum plate size(XxY) 609.6 mm x 508 mm(24”x 20”) Segmented mode-Momentum Elite 457 mm x 508 mm(18"x20") Minimum Plate Size (XxY)
Used SMT Equipment | Screen Printers
MPM UP2000HiE PRINTER Substrate treatment Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps) Thickness rang
Industry News | 2003-02-19 08:39:25.0
GSPK Circuits is Taking Courageous Steps to Bridge the Missing "complete supply solution" Service Gap to Benefit Its Customers by Investing in a Brand New Chinese Venture
Industry News | 2003-05-02 08:49:07.0
Group to Assemble Data by Package and Technology Type
Parts & Supplies | Pick and Place/Feeders
CLAMPING GAP X-BELT S25 HM2
Technical Library | 2024-03-19 15:53:34.0
Underfill is a composite material usually made of an epoxy polymer that fills gaps between a chip and its carrier or a finished package and the PCB substrate to connect the chip to the board.
Technical Library | 2024-08-20 00:40:08.0
In electronics manufacturing, 'Underfill' refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit.
FKN Systek K3000 - Singulate scored and skip scored panels up to 24" long ESD protective mat on back table Adjustable front and back support table Singulate panels with components up to 2.5" high Available in 18" blade (standard) or 24" blade (
Training Courses | ON DEMAND | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | ON DEMAND | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Sun Sep 27 00:00:00 EDT 2020 - Thu Oct 01 00:00:00 EDT 2020 | Rosemont, Illinois USA
SMTA International 2020 Conference & Exhibition
Events Calendar | Wed Dec 01 00:00:00 EST 2021 - Wed Dec 01 00:00:00 EST 2021 | ,
Wine Down Wednesday: Driving Innovation through Intrapreneurship
Career Center | Altoona, Pennsylvania USA | Sales/Marketing
MacDermid Alpha Electronics Solutions, a Element Solutions, Inc. business and world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is s
Career Center | , India | Engineering,Production
About Product Operations: Product Operations is part of Global Supply Chain Management (Global Manufacturing) and is responsible for New Product Introduction and Product Life Cycle Management from Manufacturing and Supply Operations perspective. The
Career Center | Noida, India | Maintenance,Management,Production
Over 12 years of experience in Assembly Line Production, PCB, SMT, Process Improvements, testing & troubleshooting, time and motion study, Value– Engineering as well as Quality in varied industries.
Career Center | Noida, India | Maintenance,Production
Over 12 years of experience in Assembly Line Production, PCB, SMT, Process Improvements, testing & troubleshooting, time and motion study, Value– Engineering as well as Quality in varied industries.
SMTnet Express, November 7, 2019, Subscribers: 32,325, Companies: 10,919, Users: 25,284 Origin and Quantification of Increased Core Loss in MnZn Ferrite Plates of a Multi-Gap Inductor Credits: Power Electronic Systems Laboratory (PES) Inductors
ORION Industries | http://orionindustries.com/gap-pad.php
. However, problems may still arise when heat sinks are used on irregularly sized components. Gaps between them may allow excessive heat to accumulate This is where Bergquist's Gap Pad VO(tm) shines
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_universal_instruments_polaris.html
(OCV)/recogniation (OCR), inspect voids/gaps * Bar Code Readability verification (1D or 2D matrix)., traceability of pallet/piece part
