Industry Directory | Consultant / Service Provider
Harwood Engineering Company is engaged in the development and manufacture of pressure components and systems to contain, generate, valve, control and measure the pressure of liquids and gasses.
Industry Directory | Manufacturer
UV & Thermal Cure Epoxies for Adhesives, Coatings & Sealants
New Equipment | Education/Training
If you are working with the smallest of small, surface mount components in either placement or rework of, this is the course for you. This two (2) day Advanced Surface Mount Micro Hand Soldering program focuses on the proper techniques for placement
3M™ Ultra-pure Viscoelastic Damping Polymers and 3M™ Viscoelastic Damping Polymers are used on electronic components for acoustic and vibration damping and noise control and reduction. Enhances mechanical vibration resistance High bond strength
Electronics Forum | Sat Mar 11 08:37:35 EST 2017 | tch
My company has had the same issue on our Versaflow 366 with SAC305, we tried ultrasonic cleaning and it worked for a shift and then was clogged again. We have had the machine for 3 years and we have had to replace the gassing rings twice so far. We a
Electronics Forum | Fri Feb 10 11:10:21 EST 2017 | duoman
I've been using the ERSA Versaflow 3/45 for 3 years. I've been changing the gassing rings and seals annually, but I'm going to a schedule of every 6 months. I blow my gassing rings off with compressed air. I also blow a little into the intake tube to
Used SMT Equipment | Screen Printers
We have several ECM's for sale, all in excellent condition, all gassed and in full working order. These are suitable for all DEK 265 screen printers including Typhoon class printers.
Used SMT Equipment | Soldering - Selective
Vintage 2019 The perfect plug-and-produce selective soldering system for entry-level automated soldering. holding device for workpiece carrier / workplace of 508 x 508 mm [20" x 20"], without downholders 3-axes system with spindle axes and AC servomo
Industry News | 2020-01-07 11:09:15.0
IPC-8921 establishes classifications and designations for woven and knitted e-textiles integrated with e-fibers, e-yarns and e-wires. It also standardizes key characteristics and durability testing for these materials as well as the industry test methods to be used to test against those characteristics.
Industry News | 2015-03-16 17:46:19.0
Metcal today announced that it presented REStronics Metro, its manufacturers’ representative in the New York metro area, with its Representative Group of the Year Award for 2014. The award was presented to David Leventhal, REStronics Metro Principal, during Metcal’s National Rep Meeting at the recent IPC APEX EXPO in San Diego, CA.
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
Technical Library | 2019-07-02 23:02:05.0
The introduction of lead-free solders resulted in a selection of different chemistries for solder pastes. The higher melting points of lead-free alloys required thermal heat resistant rosin systems and activators that are active at elevated temperatures. As a result, more frequent maintenance of the filtration systems is required and machine downtime is increased.Last year a different method of cleaning reflow ovens was introduced. Instead of cooling down the process gasses to condensate the residues, a catalyst was used to maintain the clean oven. Catalytic thermal oxidation of residues in the nitrogen atmosphere resulted in cleaner heating zones. The residues were transformed into carbon dioxide. This remaining small amount of char was collected in the catalyst. In air ovens the catalyst was not seen as a beneficial option because the air extracted out of the oven was immediately exhausted into the environment. When a catalyst is used in an air environment there is not only the carbon dioxide residues, but also water. When a catalyst is used in an air reflow oven the question is where the water is going to. Will it condensate in the process part of the oven or is the gas temperature high enough to keep it out of the process area? A major benefit of using a catalyst to clean the air before it is exhausted into the environment is that the air pollution is reduced dramatically. This will make environmental engineers happy and result in less pollution of our nature. Apart from this, the exhaust tubes remain clean which reduces the maintenance of air ovens.This paper will give more detailed information of catalyst systems during development and performance in production lines.
SMT256EP solderable adhesive is self-leveling and self-soldering adhesives, which has been designed for high temperature Pb-free application. By comparison with conductive adhesives (Ag), SMT256EP solderable adhesive has higher stable electrical and
The BT-1 Plasma Etch System is fully automated and is capable of processing large quantities of parts up to 21"x21" for substrate cleaning and surface modification applications prior to bonding applications. VISIT THE PLASMA ETCH WEBSITE FOR MORE IN
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
SMTnet Express, July 3, 2019, Subscribers: 32,112, Companies: 10,820, Users: 24,903 Reduce Pollution of Process Gasses in an Air Reflow Oven Credits: Vitronics Soltec The introduction of lead-free solders resulted in a selection of different
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-36-wave-soldering-insufficient-fill-and-voids-in-pth
. Check the plating in the barrels to make sure there are no voids. See IPC-600 for the criteria. Plating voids will have a tendency to create out gassing and therefore create voids in the solder joints
ORION Industries | http://orionindustries.com/pdfs/3MPR0DUCTSUMMARY.pdf
Foam Low High Mils Mils Plastic Plastic F F 100 9461P 1.0 55# DK 3.2 High Temperature, Hard disc drive seals, Low out gassing; Aerospace High 965 2.0 60# DK
