Industry Directory | Manufacturer
Depanelizer Equipment and Tools For Electronic Assembly. PCB Racks and Trays. Wire Crimp Press and Tooling.
Hi-Q Materials provides prototypw, quickturn substrates with fine line geometry. Also sell equipment for substrate fab using photoimagable technology. R&D in advanced packaging materials.
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Electronics Forum | Wed Apr 12 10:08:15 EDT 2000 | Chris May
Have you checked the pad geometry, shape / size etc ?? Regards, Chris.
Electronics Forum | Fri Dec 11 11:06:23 EST 1998 | Lyle Sherwood
DO you know of an Industry Standard that describes solder paste geometries requirements?
Used SMT Equipment | AOI / Automated Optical Inspection
Hello and thank you for your interest in our Orbotech Symbion S36 AOI For Sale. The system is Year 2006.... Excellent condition !!! Complete with all accessories and manuals. Symbion S36 Plus delivers top-of-the-line Post-Reflow AOI p
Used SMT Equipment | In-Circuit Testers
Differential Probe 3.5Ghz Tektronix proven expertise in probes brings you the highest fidelity in high-speed differential probing. The P7330 and P6330 high-bandwidth differential probes offer excellent signal fidelity, meeting the needs of engineer
Industry News | 2017-04-11 21:19:32.0
GPD Global offers versatile large format inline dispensing systems and stand-alone liquid dispense technologies for maximizing product yield. This is the largest standard PCB dispensing system platform in the industry.
Industry News | 2014-04-16 13:29:48.0
Count On Tools Inc. (COT)announces that it offers the discontinued 702/902 nozzle for ASM Siplace equipment.
Parts & Supplies | Repair/Rework
The RocHard 1 MilProbe is a 0.3" long Micro-tip in a 4 3/8" long hex shape stainless steel handle. The Micro-tip is tapered to a one mil diameter tip for TAB, BGA, and other ultra fine pitch rework. The tip is either straight (SH-341) or 50? angled a
Parts & Supplies | Pick and Place/Feeders
The new series of Siemens ESD ceramic replacement nozzles are revolutionizing the pick and place industry by offering more efficiency and outlasting all competitors' nozzles, even OEM! Special vacuum geometry provides excellent performance in the mac
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2008-10-15 20:16:12.0
Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Career Center | EDEN PRAIRIE, Minnesota USA | Production
Logic PD collaborates with clients to help them launch products that accelerate growth and capture value in the Internet of Things (IoT). Logic PD helps at any stage in the product lifecycle by being the complete product innovation and product realiz
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/geometry-too-small-for-silkscreen-outline_topic3014_post12022.html
Geometry Too Small for Silkscreen Outline - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login Geometry Too Small for Silkscreen Outline
| https://www.eptac.com/ask/inspection-criteria-for-unique-lead-geometry/
Inspection Criteria for Unique Lead Geometry - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
