Electronics Forum | Mon May 06 11:50:15 EDT 2019 | sankarseptember
I am using siplace XS Series mounter..I am getting component missing.. atleast one or two per shift production..I wonder this machine don't have option to check at last if any miss or thrown up component.what I need to check? I need any expert in sip
Electronics Forum | Wed Jun 05 10:16:29 EDT 2019 | emeto
Sankar, it looks like you need an expert to help you. Missing component might be related to hardware, machine setup or software issues on you equipment which will require a tech or engineer to investigate.
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Higher functionality, higher performance and higher reliability with smaller real estate are the mantras of any electronic device and the future guarantees more of the same. In order to achieve the requirements of these devices, designs must incorporate fine line and via pitch while maintain good circuitry adhesion at a smooth plating-resin interface to improve signal integrity. The Semi-Additive Process (SAP) is a production-proven method used on low dielectric loss tangent (Df) build-up materials that enables the manufacture of ultra-fine circuitry. (...) This paper will discuss a new SAP process for low loss build-up materials with low desmear roughness (Ra= 40-100 nm) and excellent adhesion (610-680 gf/cm) at various processing conditions. Along with the process flow, the current work will also present results and a discussion regarding characterization on the morphology and composition of resin and/or metal plating surfaces using scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDX), surface roughness analysis, plating-resin adhesion evaluation from 90o peel tests
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