Electronics Forum | Mon May 02 14:59:26 EDT 2005 | Linda Woody
Has anyone experienced electrical shorting between adjacent leads of a ceramic hermatic sealed IC? If so, can you share root cause and corrective action? The shorting appears to be in the glass frit seal itself but the failure mechanism is unknown. A
Electronics Forum | Tue May 03 21:49:45 EDT 2005 | KEN
Tin wiskers Electro migration all in the same week! (just kill me now God)
Industry News | 2010-06-21 16:04:54.0
Demonstrating its extensive knowledge base for today’s demanding back-end wafer level processes, DEK’s presence at the upcoming Semicon West event in San Francisco, California will feature the Galaxy print platform with Wafer Transport Solution. This system, displayed alongside the CHAD WaferMate 300-1, is configured with a precision wafer pallet and high-performance transport rails, ensuring the accuracy and stability required for DEK’s established and emerging cost-effective Wafer Level Packaging (WLP) applications.
| https://www.eptac.com/faqs/ask-helena-leo/ask/multiple-wash-steps-affecting-resistance-characteristics
. The other issue may be the glass frit on the resistive element, it may be missing, which would, or could, impact the functionality of the resistive element against the solvent to which it will be exposed
