Industry Directory | Manufacturer / Other
ISO certified global manufacturer and supplier of light-curable adhesives, coatings, oligomers, dispense systems, light-curing equipment, and technical consulting for the industrial, medical, and electronics industries.
two component polyurethane casting / potting system Hardness (Shore A) 48 - 58 Tensile Strength (MPa) 6.6-7.6 Elongation at break (%) 300 - 400 Rebound resilience (%) 40 - 44 Abrasion resistance (ARI%) 58 - 65 Glass tran
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Electronics Forum | Thu Jan 20 16:06:38 EST 2000 | Mike Naddra
Regarding glass transition , does anyone have expierance glass wiht transition temperature specification , such as what are the detrimental effects of exceeding the Tg , how long over the glass transition temperature ,if any , is acceptable. Tg of di
Electronics Forum | Fri Jan 21 14:51:08 EST 2000 | Dave F
Mike: I�d hate to see you making design decisions, based solely on the discussion here, but that this would be an impetus to consult IPC-D-279, "Design Guidelines ... " and take a course on designing reliable boards. Werner Engelmaier (Engelmaier
Used SMT Equipment | Board Cleaners
Speedline Electrovert Aqueous Cleaning System In-line Cleaner Model: Aquastorm 200 (Torrid Zone) Year: 2004 S/N 480409 Prewash Module: 14" (36cm ) section Vee Jets staggered nozzles, 2 upper and 2 lower spray manifolds Valve switching to div
Used SMT Equipment | Board Cleaners
Speedline Electrovert Aqueous Cleaning System Brand: Speedline Model: Aquastorm 200 (Torrid Zone) Serial #: 480409 Year: 2004 Type: In-line Cleaner Prewash Module: 14" (36cm ) section Vee Jets staggered nozzles, 2 upper and 2 lower spray m
Industry News | 2020-01-07 11:09:15.0
IPC-8921 establishes classifications and designations for woven and knitted e-textiles integrated with e-fibers, e-yarns and e-wires. It also standardizes key characteristics and durability testing for these materials as well as the industry test methods to be used to test against those characteristics.
Industry News | 2019-10-08 06:12:57.0
SHENMAO America, Inc. is pleased to announce plans to exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 23-24, 2019 at the Expo Guadalajara. The company will show its PF735-PQ10 Low Temperature Solder (LTS) and SM-862 Liquid Flux in Booth #602.
Parts & Supplies | SMT Equipment
4022 594 21990 402259421990 CNTRLLER ACM RLSE 4 NEW 4022 594 22500 402259422500 DIO CARD 4022 594 22510 402259422510 BITBUS CARD 5322 216 04099 532221604099 CAN PCB PCI 166/CAL 5322 252 11118 532225211118 FUSE, 5SX2310-7 9498 396 01043 9498
Parts & Supplies | SMT Equipment
4022 594 21990 CNTRLLER ACM RLSE 4 NEW 4022 594 22500 DIO CARD 4022 594 22510 BITBUS CARD 5322 216 04099 CAN PCB PCI 166/CAL 5322 252 11118 FUSE, 5SX2310-7 9498 396 01043 3 PHASE SAFETY RELAIS 5322 280 10304 EMER. RELAY PNOZ8/24VDC 5322
Technical Library | 1999-07-21 08:49:49.0
As the role of direct-chip-attachment increases in the electronics industry, the reliability and performance of COB packaging materials becomes an increasing concern. Although many factors influence component reliability, the biggest determinants of performance are often the glass transition temperature (Tg) and the coefficient of thermal expansion (CTE) of the encapsulant or underfill. This paper discusses exactly what these properties are, how they are measured, and why they are important to device-reliability.
Technical Library | 2014-06-26 16:43:12.0
Edgebond adhesives have been widely used by the industry for improving the shock performance of area array packages. Most of the studies focus on the impact of material properties, such as coefficient of thermal expansion (CTE) and glass transition temperature (Tg), on reliability at room temperature. However, the operating temperature of a component on the printed circuit board bonded with edgebond adhesive can be close to or exceed Tg of the adhesive, where the material properties may be very different than at room temperature.
AOI Premium Solder Pallet is lead free ESD(Electrostatic Discharge) materials comply all type of electronic manufacturing standard. It’s the ideal material for both wave soldering and reflow soldering, It has also been recognized for its long life sp
The industrial chain of laser processing has formed a complete ecological chain of laser processing from enterprises producing core lasers upstream to enterprises producing various kinds of laser processing equipment and then to enterprises providing
Career Center | Carrollton, Texas USA | Engineering,Maintenance,Production,Technical Support
The Hiring Manager is looking to interview and start the right candidate to start right away. The areas of importance for the position are experience with: 1. Process 2. Maintenance 3. Program *SMT Process and Maintenance being the top Priority
Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support
Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/processes/heat-staking-systems?con=t&page=4
Heat Staking Systems | Nordson DIMA DIMA Products Corporate | Global Directory | Languages Division Only All of Nordson Heat Staking Systems Heat Staking process De-forming the plastic is achieved by heating it to a temperature above the glass transition temperature via the use
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/RSS_determine-hole-size-for-plastic-peg-alignment-pins_topic720.xml
(Glass Transition Temperature)... Author: Tom HSubject: 720Posted: 29 Dec 2012 at 2:51pmThe Tg (Glass Transition Temperature) relates to the PCB expansion in the "Y" axis or board thickness
