Industry Directory | Consultant / Service Provider
Design and manufacture of thermal systems for rapid temperature verification and testing, and process cooling. Includes small-footprint thermal chambers and plates, mobile temperature forcing systems, and process chillers.
Industry Directory | Manufacturer
Toddco3 manufactures automated assembly equipment for the electronics industry that ACF bonds, solders or welds flexible circuits, glass, PCBs or metals.
New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
New Equipment | Cable & Wire Harness Equipment
Flag terminal NTC thermistor temperature sensor probe, surface mount housing, tin-plated copper flag terminal, with stud mounting hole, applied in industrial equipment, transit, HVAC , power and utilities, computers, home appliances, calibration and
Electronics Forum | Thu Jan 20 16:06:38 EST 2000 | Mike Naddra
Regarding glass transition , does anyone have expierance glass wiht transition temperature specification , such as what are the detrimental effects of exceeding the Tg , how long over the glass transition temperature ,if any , is acceptable. Tg of di
Electronics Forum | Fri Jan 21 14:51:08 EST 2000 | Dave F
Mike: I�d hate to see you making design decisions, based solely on the discussion here, but that this would be an impetus to consult IPC-D-279, "Design Guidelines ... " and take a course on designing reliable boards. Werner Engelmaier (Engelmaier
Used SMT Equipment | Pick and Place/Feeders
FEATURES ▶Higher productivity and quality with printing, placement and inspection process integration▶For larger boards and larger PCBs up to a size of 750 x 550 mm with component range up to L150 x W25 x T30 mm▶Higher area productivity through dual
Used SMT Equipment | General Purpose Equipment
Espec Panelized EWPT 3468 - CCW Walk-In Temperature Chamber Brand: Espec Model: EWPT 3468 - CCW Serial#: 305536 Vintage: 2003 Power: 460V 3PH 60Hz. Temperature Control System: Balanced Temperature Control System: BTC Ambient Temperature:
Industry News | 2020-01-07 11:09:15.0
IPC-8921 establishes classifications and designations for woven and knitted e-textiles integrated with e-fibers, e-yarns and e-wires. It also standardizes key characteristics and durability testing for these materials as well as the industry test methods to be used to test against those characteristics.
Parts & Supplies | SMT Equipment
SMT Juki Spare Parts JUKI 40046023 2070 2080 X PLASTIC RAIL TKP45H25 W58 R95 Specifications: Brand Name JUKI PLASTIC RAIL Part number 40046023 Model TKP45H25 W58 R95 Ensure Test in machine confirmation Guarantee 1 month usage for machine
Parts & Supplies | SMT Equipment
> E9621715000 CAMERA NO.11 LENS E9621727000 Z/THETA CTL CABLE E9621729000 YC 1 SHAFT DRIVER E9621739000 TWISTED PAIRED CABLE (5M) E96217800A0 DISPENSER CONTROLLER E9621855000 LOWER VARIABLE FILTER UNIT E9622715000 LENS E962272100A AC SERVO EN
Technical Library | 2014-06-26 16:43:12.0
Edgebond adhesives have been widely used by the industry for improving the shock performance of area array packages. Most of the studies focus on the impact of material properties, such as coefficient of thermal expansion (CTE) and glass transition temperature (Tg), on reliability at room temperature. However, the operating temperature of a component on the printed circuit board bonded with edgebond adhesive can be close to or exceed Tg of the adhesive, where the material properties may be very different than at room temperature.
Technical Library | 2014-06-19 18:13:23.0
For high-density electronic packaging,the application of flip-chip solder joints has been well received in the microelectronics industry. High-lead(Pb) solders such as Sn5Pb95 are presently granted immunity from the RoHS requirements for their use in high-end flip-chip devices, especially in military applications. In flip-chip technology for consumer electronic products, organic substrates have replaced ceramic substrates due to the demand for less weight and low cost. However, the liquidus temperatures of high-Pb solders are over 300°C which would damage organic substrates during reflow because of the low glass transition temperature. To overcome this difficulty, the composite solder approach was developed...
The Vortik VPm Progressive Cavity Pump dispensing two-component materials for encapsulation.
http://www.pcb-separator.com/plus/view.php?aid=86 ??????????? ???????? ????/LED separating/LED panel separating/PCB depaneling device/???????/online separating
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | San Jose, CA, California USA | Engineering,Production,Research and Development
Senior PCB Designer: Want to be part of an exciting pre-IPO enterprise B2B company working on the cutting edge of internet-of-things, artificial intelligence & agents, blockchain, and manufacturing technology? This well-funded venture-backed co
SMTnet Express, June 19, 2014, Subscribers: 22851, Members: Companies: 13906, Users: 36363 Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints Y
Imagineering, Inc. | https://www.pcbnet.com/blog/high-temperature-pcb-considerations-for-high-heat-applications/
? What is a High Temperature PCB? A high temperature circuit board is generally defined as an instance where the glass transition temperature (or Tg
Heller Industries Inc. | https://hellerindustries.com/parts/7608k/
7608K - DY O2 ANALYZER GLASS FILTER Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
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