Industry Directory | Manufacturer
Porous ceramic vacuum chuck table or Polishing Chuck table supplied to semiconductor industry for silicon wafer dicing or finishing purposes. This product is an uniform compact frame, high strength, g
Welcome to the next generation in PWB test solutions. We combine an exceptional team of technology and applications experts with HIOKI's industry-leading systems to enhance your reliability and to speed up your product development process.
New Equipment | Board Handling - Conveyors
This vacuum loader is used for both picking up bare PCBs by vacuum and transferring them to the downstream process line. It can be incorporated in the line along with the magazine loader for efficient operation. FEATURES: Includes safety cover
The XACT 4 automatic screen and stencil printer is specially designed to perform any kind of production demands within the electronic industry, and therefore paying special attention to its universal usage. The XACT 4 features the exceptional EKRA ea
Electronics Forum | Thu Dec 28 12:19:20 EST 2006 | slthomas
So I'm the only one that's had crappy piles of silkscreen between pads?
Electronics Forum | Tue Jan 02 09:47:41 EST 2007 | slthomas
We had a supplier that put a [fuzzy and of variable height) line of ss between all chip R and C pads. Of course we were in low cost mode and had purchased a year's worth of boards.
Used SMT Equipment | Repair/Rework
Warranty: 90 days parts & labor against manufacturing defects - wear items not included 1IR550A000A67 1 PC IR550A Infrared Rework System - 115V/US 1600 W heating power -800 W bottom side - 135 x 260 mm -800 W top side - 60 x 60 mm 1 K-type themoco
Used SMT Equipment | Screen Printers
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Industry News | 2023-07-22 11:28:46.0
If need more technical support , pls contact with us at Jenny@ksunsmt.com
Industry News | 2022-10-12 07:22:35.0
I.C.T As an SMT Factory Solution Partner, Mainly Provide Full SMT Line Machine. Including SMT Pick and Place Machine, PCB Reflow Oven, SMT Stencil Printer, PCB Wave Soldering Machine, PCB Handing Machine and SMT Peripheral Equipment for Global Customers.
Parts & Supplies | Pick and Place/Feeders
SMT basic process components include: silk screen (or dispensing), placement (curing), reflow soldering, cleaning, testing, repair 1, silk screen: its role is to paste or patch solder paste printed on the PCB pad, the components f
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Parts & Supplies | Pick and Place/Feeders
PT01940 NXT gear Model: FUJI Mounter Specification: PT01940 Part No.: PT01940 Name: NXT gear A5054H FUJI seal ABTRG1120 FUJI GL541 glue bobbin BTPT0961 FUJI belt pulley BTRG0391 GL541E Dispenser head gear DCPA0730 FUJI Mounter Parts DCP
Technical Library | 2017-09-07 13:56:11.0
As a surface finish for PCBs, Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research available on-line. Challenges in the wire bonding process on ENEPIG with regards to bondability and other plating related issues are summarized.
Technical Library | 2017-08-31 13:43:48.0
Wire bonded packages using conventional copper leadframe have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Proper optimization of wire bond parameters and machine settings are essential for good yields. Wire bond process can generate a variety of defects such as lifted bond, cracked metallization, poor intermetallic etc. NSOP – non-stick on pad is a defect in wire bonding which can affect front end assembly yields. In this condition, the imprint of the bond is left on the bond pad without the wire being attached. NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes observed and the efforts to address NSOP reduction
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
LED panel is a kind of flat panel display which is composed of small LED modules. It is the largest and most widely used large-screen panel technology at present. It can be used not only indoors but also outdoors, waterproof, windproof and rain proo
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | NORTHRIDGE, California USA | Engineering
EDUCATION BS Electronics and Communication Engineering Gujarat University MS Electrical Engineering California State University, Northridge ACADAMIC PROJECT Fabrication and Characterization of Silicon Carbide (SiC) MESFE
Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support
SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.
ASCEN Technology | https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/936.html
machine.NG panel rejects conveyor is used for NG PCB can be lifted up for visual inspection without stopping.OK PCB p Send Enquiry Download brochure Product Details Application
Lewis & Clark | https://www.lewis-clark.com/product-tag/large-board-3d-aoi/
&Theta, Presence, Absence & Polarity 3D Profiler Tool – Solder Joint Inspection & Lifted Lead Detection OCV – Optical Character Verification Match Maker Tool for Fast Program Creation Library Pro for Inspection Quality Insurance Library Live Update Teach
