Industry Directory | Other / Consultant / Service Provider / Manufacturer
ScanCAD is an industry leader in inspection, measurement, process control and reverse engineering. Our solutions support OEM's, manufacturers, stencil fabricators, repair depots, and others in optimizing quality and yield.
Industry Directory | Manufacturer
Manufacturer of automated production systems;PCB magazine loader,PCB separator,PCB cutting machine,PCB unloaders, PCB conveyors,PCB depaneling machines,PCB turn conveyors,PCB conformal coaters,PCB solder paste printer,PCB buffer
New Equipment | Solder Paste Stencils
For the DIYer, hobbyist or technical researcher there are times where all you need is a simple means to apply solder paste for SMT devices for a few simple boards. In those cases a plastic SMT stencil may be the right solution. Eliminate the tedious
New Equipment | Cleaning Equipment
Automatic SMT Stencil Cleaning Machine BMP-1000X Feature ▶The cleaning tank, the original tank, and the spray tank are designed with a liquid level sensor overflow alarm. ▶The opening of the front door is designed with photoelectric sensor protectio
Used SMT Equipment | Screen Printers
Description Make: Speedprint Model: SP710 AVI Year: 2014 Type: Screen Printer
Used SMT Equipment | Board Cleaners
Speedline Electrovert AquaJet Aqueous Batch Cleaning System Designed to clean and dry Stencils, Screens, Misprints, Glue and Solder-Paste. Dimensions: 61.75" W x 72.75" D x 58.84" Tall
Industry News | 2016-10-25 09:47:33.0
Learn about SMT assembly from SME Phil Zarrow in Chicago
Industry News | 2003-04-30 08:51:08.0
Electrolube played the role of environmental champion in Australia recently.
Technical Library | 2014-03-13 15:25:01.0
A student competition paper at Budapest University of Technology And Economics, Department of Electronics Technology gives background, covers stencil design and discusses stencils intended for pin in paste application. The stencil applied for depositing the solder paste is a thin, 75–200 µm thick metal foil, on which apertures are formed according to the solder pads on the printed circuit board. Stencil printing provides a fast, mass solder paste deposition process; relatively expensive, appropriate and recommended for mass production.
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Automatic SMT Stencil Cleaning Machine BMP-1000X Feature ▶The cleaning tank, the original tank, and the spray tank are designed with a liquid level sensor overflow alarm. ▶The opening of the front door is designed with photoelectric sensor protectio
Events Calendar | Tue May 30 18:30:00 UTC 2023 - Tue May 30 18:30:00 UTC 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
Career Center | Sherman, Texas USA | Engineering,Production,Research and Development,Technical Support
SMT Packaging Engineer: Location: Texas - Sherman , TX Group: HVAL Degree Requirements: BS ME/ChemE/Materials The person in this position will have the ability to make very significant financial contributions to TI because this is a very critic
Career Center | Porterville, California USA | Production
Please refer to Req. No.: 01-2154-0000-53 in all correspondence. * * * * * * Market Guidelines for Pay: $ 3474 � 5210/month. Excellent benefits package available. Supervise and provide process engineering support for the surface mount manufacturing
Career Center | Mysore, Tirane India | Engineering,Production,Quality Control,Technical Support
· New Product production line setup, Risk assessment, quality system deployment. · Process Engineering activities, PCB Design review w.r.t Design for manufacturability in Pilot lot. · Printed wiring Assembly Process Improvement (Stencil, PCB type, sc
Career Center | NORTHRIDGE, California USA | Engineering
EDUCATION BS Electronics and Communication Engineering Gujarat University MS Electrical Engineering California State University, Northridge ACADAMIC PROJECT Fabrication and Characterization of Silicon Carbide (SiC) MESFE
Breakthrough in Molecular Design Featured Article Breakthrough in Molecular Design Could Unleash the Full Speed of the Internet Washington State Magazine Cherie Winner PULLMAN,Wash.- Researchers at Washington State University have created design
| https://www.smtfactory.com/I-C-T-6534-Solder-Paste-Stencil-Printer-Machine-pd42676824.html
Cleaning Machine Stencil Cleaning Machine PCB Protector PCBA Coating Machine Automatic Dispensing Machine Glue Potting Machine I.C.T Curing Oven IR Curing Oven UV Curing Oven Traceability Equipment Automatic Laser Marking Machine Automatic Label Mounter Automatic Inkjet Printing Machine Benchtop Robot Soldering Robot Screwing
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/
. Solder paste must also be properly stored and handled per the guidelines of a manufacturer. Water soluble solder paste can also contribute to excess moisture. Stencil Design
