Electronics Forum: glue to reduce tombstone (7)

Re: How to do with tombstoning for component '0402'

Electronics Forum | Wed Nov 01 14:42:17 EST 2000 | MRMAINT

We had some similar issues on one of our products.The oven profile is critical. We found that with a gradual soak ramp up it took care of about 80% of the tombstoning.The other thing that we found was pad design issues. Take a look at the sept. issu

Re: How to do with tombstoning for component '0402'

Electronics Forum | Thu Nov 02 22:19:32 EST 2000 | Dason C

For 0402 or less, it is prefer to start on the pad design but it doesn't help right now. Senju Metal say that they have develop one of the paste can reduce the tombstoning problem but I don't have chance to test it. Please try and post your finding

Used SMT Equipment: glue to reduce tombstone (9)

Fuji AIMEXIIIC

Fuji AIMEXIIIC

Used SMT Equipment | Pick and Place/Feeders

Make:  FUJIModel: FUJI AIMEXIIICDetails:1.Compact Size: The AIMEXIIIC is designed to be compact, suitable for production environments with limited space. The machine size is L: 1,280 x W: 2,346 x H: 1,465 mm.2.High Versatility: Supports placement fro

Extension Electromechanical equipment HK Co.,Ltd

Fuji AIMEXIIIC

Fuji AIMEXIIIC

Used SMT Equipment | Pick and Place/Feeders

Make:  FUJIModel: FUJI AIMEXIIICDetails:1.Compact Size: The AIMEXIIIC is designed to be compact, suitable for production environments with limited space. The machine size is L: 1,280 x W: 2,346 x H: 1,465 mm.2.High Versatility: Supports placement fro

Extension Electromechanical equipment HK Co.,Ltd

Industry News: glue to reduce tombstone (19)

Vi TECHNOLOGY to Present Its New 3D AOI System to the U.S. Market at APEX

Industry News | 2016-02-18 20:38:36.0

Vi TECHNOLOGY will exhibit in Booth #2534 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. For the first time in the U.S., Vi TECHNOLOGY will show the K Series3D, its new 3D AOI, coupled with PI series (3D SPI) and SIGMA Link, resulting in a complete 3D inspection solution.

Vi TECHNOLOGY

Vi TECHNOLOGY Brings a Complete 3D Inspection Solution to 3 Booths at NEPCON S China

Industry News | 2016-07-30 19:42:12.0

Vi TECHNOLOGY will exhibit with WKK (booth 1J55), American Tec (booth 1H40) and FTCL (booth 1H50) at NEPCON South China, scheduled to take place Aug. 30-Sept. 1, 2016 at the Shenzhen Convention & Exhibition Center. Vi TECHNOLOGY will show the K Series3D, its new 3D AOI, coupled with PI series (3D SPI) and SIGMA Link, resulting in a complete 3D inspection solution.

Vi TECHNOLOGY

Videos: glue to reduce tombstone (1)

DIP Double-side Camera Online AOI Machine ETA-V5300

DIP Double-side Camera Online AOI Machine ETA-V5300

Videos

DIP Double-side Camera Online AOI Machine ETA-V5300​ If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI mac

Dongguan Intercontinental Technology Co., Ltd.

Career Center - Resumes: glue to reduce tombstone (1)

Project Manager - Electronics Products

Career Center | , | Engineering,Production

Project Management, SMT Process Engineering

Express Newsletter: glue to reduce tombstone (292)

Tombstone Troubleshooting

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Partner Websites: glue to reduce tombstone (1177)

How to load material to medical mask making production line -PCB magazine loader,PCB turn conveyor,p

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