Industry Directory | Manufacturer
We are manufacturer of 2K potting technology AB glue dispensing machine Epoxy dispensing machine Two-component dispensing machine，Dual-component dispensing machine Meter-mix dispensing machine，Resin dispensing machine
New Equipment | Rework & Repair Equipment
PMP-500 First Article Tester V2.0 PTI-500 First Article Inspection Tester Overview PTI-500 First Article Inspection Tester is mainly used for the first article inspection of the SMT production process in electronics factories. The operation of the t
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PTI-500 First Article Inspection Tester 版本号：PTI500V2.0 、 PRODUCT FUNCTIONALITIES ✦ADVANCED SOFTWARE, USER FRIENDLY INTERATIVE OPERATION MINIMALIST DESIGN ✦INTUITIVE VIEW OF TEST RESULT The test result is plotted on individual component which can be
Electronics Forum | Thu Jun 20 16:59:57 EDT 2002 | davef
We look at gluing and pasting second side components as two different processes, NOT alternative processes. Given our drothers, we'd paste / place / reflow all day long, before we'd want to glue. We glue because we have to glue. The main driver to
Electronics Forum | Wed May 14 10:20:37 EDT 2014 | julianf
Hello all! For my mechanical engineering study I want to etch a strain gauge in the Wheatstone bridge configuration in a copper layer of an PCB. The goal is to measure the strain occurring in an PCB even during the press process! We can measure with
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2017-10-24 06:00:46.0
At productronica in Munich/Germany, ULT AG will demonstrate its unique state as a full-range supplier of extraction and filtration technologies for air purification within electronics manufacturing. The company will present solutions for the efficient and economic removal of airborne pollutants, such as laser fume, soldering fume, gases, vapors, dusts, and odors.
Parts & Supplies | Tape and Reel
Kapton tape Discriptions: 1. We can according to customer's request and mode making to order. Accept OEM. 2. In the SMT process, the backflow stove measured when furnace temperature glues the thermocouple wire; 3. In the SMT process, uses in gluing
Technical Library | 2017-11-10 00:58:37.0
Modern electronics manufacturing is made up by a multiplicity of different separation and joining processes, with the later surely taking the vast majority of production technology. Alongside gluing, welding and laser processes, soldering still holds a primary position in electronic assemblies. However, soldering does not always equal soldering, because there are quite a lot of different soldering technologies. Accordingly, you have to distinguish between automated and manual soldering procedures. No matter which soldering process you analyse, all of them have one aspect in common: they produce airborne pollutants, which may have a negative impact on employees, plants and products as well.
Technical Library | 2021-04-16 05:38:38.0
The overall process of manufacturing electronics assemblies is characterized by a number of very different procedures. Along the production chain, technologies for cutting, assembling, soldering, bonding, gluing, marking, potting, etc. are used, all of them have one thing in common: They produce airborne pollutants, some of which can have a significant impact on employees, manufacturing equipment and products - and for this reason need to be removed effectively and efficiently.
ETA Online Jet Dispensing Machine D400 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. Dispensing Machine,SMT Glue Dispensing Machine,Dispe
I.C.T PCB LED Dispensing Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. smt,Dispensing Machine,SMT Glue Dispensing Machine,Dispensing
of the manufacturing process. In fact, an automated sten
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processing of more packages per single process operation. Packing technique such as eWLB/FO WLP, Embedded, SiP, RCP and 2D/3D assembly are targeting benefits of large scale assembly for KGD and post process cost benefits
