Electronics Forum: gold embrittlement joint microsectio (60)

Re: Gold embrittlement

Electronics Forum | Thu Nov 11 18:39:06 EST 1999 | John Thorup

Assuming that you are going to solder them into a board rather than socket them, yes. The thickness of the gold plating in this application will usually make up a large enough percentage of the total joint to threaten enbrittlement. Use a small sol

Re: Gold embrittlement

Electronics Forum | Fri Nov 12 16:27:43 EST 1999 | Michael Allen

The papers I've read suggest that we need to be concerned if the weight percent of gold in the finished joint exceeds 3%. You might want to do the calculations to see where you stand, before you set up a process to "tin" the leads. If you find that

Express Newsletter: gold embrittlement joint microsectio (282)

SMTnet Express - August 7, 2014

SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk

Partner Websites: gold embrittlement joint microsectio (12)

Dissolution Rate of Specific Elements in SAC305 Solder

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255

. One example of how the interactions between solder and surface finish can affect solder joint integrity is the potential formation of brittle gold/tin intermetallic compounds (IMCs

Surface Mount Technology Association (SMTA)


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