Electronics Forum | Fri Sep 14 02:18:32 EDT 2001 | gsparka
Hi. After reflow soldering. There are lots of non wetting of leads. 71 b'd all are mounted resister,condensor,qfp,plcc,bga have got the defects so many. all defecs occured in the fine pitch ic. others are good. On some fine pitch pads not mou
Electronics Forum | Mon Sep 22 17:02:58 EDT 2008 | hegemon
You are on the right track Ismir. Essentially however, as the programmer of the machine, I am the one that creates the PCB with the errors to benchmark the settings for the machine. No secret lab though! :-) Easy enough for most any AOI machine to
Industry News | 2018-10-18 10:16:53.0
Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Technical Library | 2019-04-17 21:29:14.0
Electroless nickel electroless palladium immersion gold (ENEPIG) surface finish for printed circuit board (PCB) has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This paper presents the reliability of land grid array (LGA) component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.
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Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies
SMTnet Express, October 3, 2013, Subscribers: 26314, Members: Companies: 13485, Users: 35243 Pyrolysis of Printed Circuit Boards by T. R. Mankhand, K. K. Singh, Sumit Kumar Gupta, Somnath Das; Indian Institute of Technology PCB is an essential
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Top 10 SMT New Product Stories of 2014 - PCB Libraries Forum Forum Home > General > General Discussion New Posts FAQ Search Events Register Login Top 10 SMT New Product Stories of 2014
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
). Bridging Formation of a solder alloy connection between two or more adjacent contacts. Bumped Circuit Boards Bare printed circuit boards that have had solder paste deposited and reflowed on the pads prior to component installation
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