New SMT Equipment: gold plating for ausn (12)

QSX-295T - XRF Analyzer for Metal Testing

QSX-295T - XRF Analyzer for Metal Testing

New Equipment | Test Equipment

Highly Accurate, Full Precious Metal Analysis The QSX-295T was developed with over twenty years of experience working with jewelers from New York City to Los Angeles. The analyzer offers a simple to operate solution for highly accurate identificati

Quickshot XRF

one-Stop EMS service for turnkey PCBA board

one-Stop EMS service for turnkey PCBA board

New Equipment | Assembly Services

The board is designed by customer and we did one-Stop EMS Service for this project (PCB manufacture, components sourcing, SMT and THT assembly): Product name: 4 Layer PCBA board Material: FR-4 TG170 Thicknss: 1.6mm Surface: HASL Solder mask: Green 

Shenzhen ZhongFeng Electronic Technology Co.,Ltd

Electronics Forum: gold plating for ausn (40)

Re: Nickle plating for SS Metal switch...

Electronics Forum | Mon Dec 22 16:09:02 EST 1997 | Justin Medernach

| I am designing an SMT pad for a ss metal switch. | Finished copper thickness is .0014 and nickle-plating | originally is 150 millionths. Initial testing yields 100,000 to 150,000 switches before intermitent failures (copper is reached.) I want 50

solder SnPb wire to gold plated IC

Electronics Forum | Sat Apr 14 09:28:58 EDT 2007 | davef

When soldering a component to a board, the solderability protection on the component combines with the solderability protection on the board and the solder to form an alloy. This alloy is unique for that combination of solder and solderability protec

Industry News: gold plating for ausn (22)

Different Techniques for Plating

Industry News | 2018-10-18 11:08:03.0

Different Techniques for Plating

Flason Electronic Co.,limited

IPC Volunteers Honored for Contributions to Electronics Industry at IPC APEX EXPO

Industry News | 2016-03-22 16:48:06.0

IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at the Las Vegas Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.

Association Connecting Electronics Industries (IPC)

Parts & Supplies: gold plating for ausn (3)

Juki  nozzle 105 for 705 smt machine

Juki nozzle 105 for 705 smt machine

Parts & Supplies | SMT Equipment

Juki nozzle 105 for 705 smt machine Description: Brand:JUKI Color:plated gold Material:imported steel Nozzle model:101 102 103 104 105 106 Application:Juki 750 smt machine Customize:yes Nozzle advantage: 1.The nozzle main body adopts impor

KingFei SMT Tech

Juki Juki nozzle 105 for 705 smt machine

Juki Juki nozzle 105 for 705 smt machine

Parts & Supplies | SMT Equipment

Juki nozzle 105 for 705 smt machine Description: Brand:JUKI Color:plated gold Material:imported steel Nozzle model:101 102 103 104 105 106 Application:Juki 750 smt machine Customize:yes Nozzle advantage: 1.The nozzle main body adopts impor

KingFei SMT Tech

Technical Library: gold plating for ausn (2)

Brief description of ENIG for Multilayer PCB

Technical Library | 2013-01-18 02:42:14.0

ENIG (Electroless Nickel/Immersion Gold) is to deposit nickel gold plating which has good solderability, wear resistance , leveling appearance and small electric resistance. It included 4 steps that are pretreatment, immersion nickel, immersion gold and Post treatment...

Everest PCB equipment Co.,Ltd

Effect of Process Variations on Solder Joint Reliability for Nickel-based Surface Finishes

Technical Library | 2014-11-06 16:43:24.0

This paper summarizes the results of recent investigations to examine the effect of electroless nickel process variations with respect to Pb-free (Sn-3.0Ag-0.5Cu) solder connections. These investigations included both ENIG and NiPd as surface finishes intended for second level interconnects in BGA applications. Process variations that are suspected to weaken solder joint reliability, including treatment time and pH, were used to achieve differences in nickel layer composition. Immersion gold deposits were also varied, but were directly dependent upon the plated nickel characteristics. In contrast to gold, different electroless palladium thicknesses were independently achieved by treatment time adjustments.

Atotech

Express Newsletter: gold plating for ausn (207)

SMTnet Express - August 7, 2014

SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk

Partner Websites: gold plating for ausn (88)

IPC Standards for Manufacturing & Assembly - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post9030.html

and Flexible Adhesive Bonding Films IPC-4204 - Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry IPC-4552 - Specification for Eletroless Nickel/Immersion Gold (ENIG

PCB Libraries, Inc.

PCB Prototyping: What Should You Be Looking For?

Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-prototyping-what-you-should-be-looking-for/

. Copper weights range from 1 to 4g. Finish plating can be leaded solder, or any following RoHS-compliant finishes: lead-free solder, immersion gold, immersion silver, white tin, or OSP

Imagineering, Inc.


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