Industry Directory | Manufacturer's Representative
Specialty materials for SMT Assembly. Solder Paste, Spheres, Tac Fluxes, Flip Chip Fluxes, Solder wi
For everything from high volume, low cost capacitors to application specific ceramic solutions, Johanson Dielectrics has you covered. The mission of the Johanson Companies is to translate our customer needs into quality electronic components, produ
Welwyn Components� new SMT facility contains the latest manufacturing techniques for both standard and specialist chip resistors. These include high speed/ high precision printing and lasering equipment, grading and tape packing machines and a state
Electronics Forum | Fri Feb 28 01:36:43 EST 2020 | crystal12
> What is the use of gold plated boards? <BR> <BR> With the increasing integration of IC, the more IC the more dense. The vertical tin spray process is difficult to flatten the pads, which brings difficulty to the SMT mounting, and
Electronics Forum | Tue May 13 06:57:10 EDT 2003 | davef
Your vendor site is totally correct. 2Ag is an excellent solder, but it does nothing to prevent tin and gold from reacting chemically. An earlier poster is correct gold goes into solution in liquid solder very fast, less than a second. Gold and ti
Industry News | 2018-10-18 10:25:53.0
Marking Diode Poles on Silkscreen Layer
Industry News | 2016-03-03 08:27:28.0
Nordson MARCH has recently released a white paper showing the results of RF plasma processing on conformal coating adhesion, the conformity of the coating coverage, and the resulting effects on electrical functionality of a fully assembled printed circuit board. The research was done in conjunction with Nordson ASYMTEK, AirBorn Electronics, and SMART Microsystems (formerly known as Desich SMART Center). The paper can be downloaded at http://bit.ly/MARCH-PlasmaWP.
Parts & Supplies | Pick and Place/Feeders
YAMAHA TIMING BELT KGT-M7181-00X for smt machine KG7-M9115-00X YAMAAH YV100II W AXIS RAIL MOTOR BELT KKT-M9127-50 YAMAHA YS24 X Axis CONVEYOR BELT KGB-M7137-00X YAMAHA YV100XG HEAD ANGLE BELT KLW-M957H-00X YAMAHA YSM200
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Parts & Supplies | SMT Equipment
00347863-01 SW CAN-Terminal-Programm 00347980-01 HOLDER RIGHT SIDE S23 CUTTER UNIT 00348121-01 Servicebox SIPLACE S-27 HM. Provided free of charge with initial system installation.Indicated price valid for additional orders. 00348184-01 Stripper r
Technical Library | 2017-09-07 13:56:11.0
As a surface finish for PCBs, Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research available on-line. Challenges in the wire bonding process on ENEPIG with regards to bondability and other plating related issues are summarized.
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk
Gold Wire Bonding Performance and Reliability of ENEPIG Surface Finishes Gold Wire Bonding Performance and Reliability of ENEPIG Surface Finishes The expression "multifunctional PCB", as a synonym for a PCB which is applicable with a variety
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Intermetallic Growth on PCB-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> News Intermetallic Growth on PCB Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead
Heller Industries Inc. | https://hellerindustries.com/intermetallics-growth/
Intermetallic Growth on PCB - Heller Home » Intermetallic Growth on PCB Re-printed in partnership with ITM Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead (from plating) and to the pad
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
