New SMT Equipment: gold pollution (120)

SMT Offline AOI Inspection Machine ZW 500

SMT Offline AOI Inspection Machine ZW 500

New Equipment | Test Equipment

SMT Offline AOI Inspection Machine ZW 500 Dimension:900*1100*1350 mm PCB width:30x30-450x330mm Inspection Component: 0402 chip Weight:Aprox. 450kg Product description: SMT Offline AOI Inspection Machine ZW 500 SMT Offline AOI Inspection Mac

Flasonsmt Co.,ltd

SMT Offline AOI Inspection Machine ZW 500

SMT Offline AOI Inspection Machine ZW 500

New Equipment | Test Equipment

SMT Offline AOI Inspection Machine ZW 500 Dimension:900*1100*1350 mm PCB width:30x30-450x330mm Inspection Component: 0402 chip Weight:Aprox. 450kg Product description: SMT Offline AOI Inspection Machine ZW 500, Dimension:900*1100*1350 mm, PC

Flasonsmt Co.,ltd

Industry News: gold pollution (4)

AIM – Soldadura de Mexico Receives Clean Industry Certification

Industry News | 2011-10-21 13:18:46.0

AIM announces that its Mexican facility, Soldadura de Mexico, has received its Clean Industry Certification.

AIM Solder

Semblant Launches Semblant Plasma Finish (SPF) Premier Partner Program

Industry News | 2012-09-25 16:25:15.0

Stevenage Circuits Ltd. offers Semblant Plasma Finish to address growing OEM demand for PCB surface finish advancements

Semblant

Technical Library: gold pollution (1)

High Phosphorus ENIG – highest resistance against corrosive environment

Technical Library | 2023-01-10 20:15:42.0

Over the past years there has been consistent growth in the use of electroless nickel / immersion gold (ENIG) as a final finish. The finish is now frequently being used for PBGA, CSP, QFP and COB and more recently gathered considerable interest as a low cost under-bump metallization for flip chip bumping application. One of the largest users for this finish has been the telecommunication industry, were millions of square meters of PCBs with ENIG have been successfully used. The nickel layer offers advantages such as multiple soldering cycles and hand reworks without copper dissolution being a factor. The nickel also acts as a reinforcement to improve through-hole and blind micro via thermal integrity. In addition the nickel layer offers advantages such as co-planarity, Al-wire bondability and the use as contact surface for keypads or contact switching. Especially those pads, which are not covered by solder need a protective coating in corrosive environment – such as high humidity or pollutant gas.

Atotech

Express Newsletter: gold pollution (87)

SMTnet Express - August 7, 2014

SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk

Partner Websites: gold pollution (6)

Environmental Sustainability

GPD Global | https://www.gpd-global.com/co_website/about-environment.php

: Natural Resources conservation such as reducing power usage and more Pollution prevention in any form Hazardous waste minimization in factories and through equipment usage Complying with restrictions

GPD Global

GoGreen CO₂ Ticket of productronica

| https://productronica.com/en/trade-fair/tickets/gogreenticket/

(Gold Standard, Plan Vivo) and demonstrably make a positive contribution to sustainable development locally and regionally. Let us walk the path to a greener future together


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