Industry Directory: gold purity (1)

AIM Solder

Industry Directory | Manufacturer

AIM is a leading global manufacturer of solder assembly materials for the electronics industry.

New SMT Equipment: gold purity (2)

Bonding Wire

Bonding Wire

New Equipment | Components

Gold / Aluminum / Copper Bonding Wires The bonding wires is the most important material used in making electrical connections between the chip and the external circuit. It has good conductivity and corrosion resistance, and it could be used for extr

Plastlist Group

Henkel Electronics Assembly Film Adhesives

Henkel Electronics Assembly Film Adhesives

New Equipment | Materials

The Henkel line of adhesives includes high temperature electrically conductive epoxy products for every customer’s needs. As the leader in thermal film formulation technology, Henkel has developed a wide variety of film materials for multiple appli

Henkel Electronic Materials

Electronics Forum: gold purity (11)

aluminium wire bonding on Electroless Nickel + Immersion gold

Electronics Forum | Fri Aug 17 11:55:31 EDT 2001 | davef

5uin. Your nickel thickness is fine. Although if you wanted to trade costs, consider giving-up nickel to 150uin thickness, while increasing the gold thickness. Gold over electroless nickel creates brittle joints because of phosphorous in the nicke

Re: Tinning gold plated leads ( DIP, etc)

Electronics Forum | Tue Mar 21 20:25:30 EST 2000 | Dave F

John: What�s the matter? Free gold � good thing for you, bad thing for your supplier. :^) Pre-tinning of gold plated leads is important to: � Prevent gold embrittlement of the solder joint � Determine if the leads are solderable prior to assembly (

Industry News: gold purity (6)

Guideline for wire bonding

Industry News | 2019-11-05 22:19:03.0

> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.

Headpcb

Metals Recycler Conecsus Partners with Amerway, Cobar for ‘Cradle to Grave’ Solution

Industry News | 2017-08-06 19:43:49.0

Conecsus, LLC, announced today that they are partnering with Amerway Inc., and COBAR Balver Zinn Solder Products, two leading global solder manufacturers, to provide a ‘cradle to grave’ solution for electronics manufacturers. Conecsus, LLC is an ISO 14001 EMS certified recycling company and a refiner of SMT solder/solder paste wastes and residues, as well as Tin, Lead, Antimony, Silver, Gold, and other metals from a variety of manufacturing industries. Conecsus converts these wastes into usable metal products, paying cash to the customer.

Conecsus LLC

Express Newsletter: gold purity (83)

Partner Websites: gold purity (2)

Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf

) are similarly used in packages requiring additional reflow cycles. As a contrast to compliant TIMs, gold alloys (for AuSn20, k~57 W/m-K) provide solutions where the bond and alloy are strong enough to deflect the package to absorb thermal strains

Heller Industries Inc.


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